Crack Detection Bumps for Flexible Display Bonding
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Solution Overview
Problem
Existing display devices face challenges in reliably detecting damage to flexible display panels during the bonding process with driving circuits, particularly cracks that can occur due to pressure, which affects the device's reliability and functionality.
Innovation Solution
Incorporating a crack detection line adjacent to the edges of the driving circuit and connected to crack detection bumps, which are electrically connected to resistance test pads or a comparison unit, allowing for resistance measurement to detect cracks and ensure proper bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a flexible display panel is bonded to a driving circuit using pressure, then the bonding strength is improved, but cracks may occur in the display panel due to excessive pressure
Solution Approach 1:
The patent applies preliminary action by pre-forming the bump structure with a hollow interior space before the bonding process. This pre-formed structure serves as a pressure buffer that will absorb excessive pressure during bonding, preventing cracks in the display panel while maintaining adequate bonding strength.
Solution Approach 2:
The hollow interior space within the bump structure acts as a cushioning element before the bonding process occurs. During bonding, this hollow space absorbs excess pressure, protecting the flexible display panel from cracking while still allowing sufficient pressure transmission for proper bonding between the driving circuit and panel.
2Strength
If the bump structure is made solid to increase structural strength, then mechanical strength is improved, but the ability to buffer pressure during bonding is reduced
Solution Approach 1:
The bump structure employs local quality by having different properties in different regions: the exterior wall provides structural strength and mechanical support, while the hollow interior space provides pressure buffering capacity. This localized differentiation of properties allows the single bump structure to simultaneously satisfy both requirements.
3Device complexity
If conventional bonding processes are used without crack detection structures, then the manufacturing process is simpler, but damage to the display panel cannot be detected
Solution Approach 1:
The patent merges the bonding structure and crack detection functionality into a single integrated bump structure. The hollow interior space serves dual purposes: buffering pressure during bonding and enabling crack detection through resistance measurements, thereby eliminating the need for separate detection structures and keeping the manufacturing process relatively simple.
Solution Approach 2:
The bump structure exhibits multi-functionality by simultaneously serving as a bonding element, a pressure buffer, and a crack detection sensor. This universal design allows one structure to perform multiple functions that would traditionally require separate components, maintaining manufacturing simplicity while adding detection capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables effective detection of cracks during the bonding process, enhancing the reliability and durability of the display device by ensuring early identification and prevention of driving circuit failures.
Implementation Method 1
at least a portion of the crack detection line may be disposed adjacent to an edge of the driving circuit
Data Source
AI summary
A display device includes a display panel including a display area displaying an image, a non-display area adjacent to the display area, and a plurality of signal lines, and a driving circuit disposed in the non-display area, wherein the driving circuit includes a plurality of bumps arranged in a plurality of rows. The plurality of bumps include a crack detection bump arranged in at least one row among the plurality of rows, the plurality of signal lines include a crack detection line electrically connected to the crack detection bump, and at least a portion of the crack detection line is disposed adjacent to an edge of the driving circuit.