Crack Detection Ring Layout for Semiconductor Seal-Ring Protection
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Solution Overview
Problem
Semiconductor devices face issues with cracks and peeling due to sawing processes or external forces, which affect productivity and manufacturing costs, as existing technologies struggle to effectively prevent and detect these defects accurately.
Innovation Solution
A semiconductor device design incorporating a crack detection ring and structure, including multiple seal-rings and controllers, which electrically connect to the crack detection ring to provide current or voltage and compare it with reference values, allowing for the detection and estimation of crack locations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a crack detection ring and multiple seal-rings are added to the semiconductor device structure, then crack detection precision and reliability are improved, but device complexity increases
Solution Approach 1:
The device is segmented into functional rings: a first seal-ring surrounding the circuit region, a crack detection ring surrounding the first seal-ring, and a second seal-ring surrounding both. This segmentation allows the crack detection function to be isolated in a dedicated ring structure, improving detection precision while organizing complexity into manageable segments.
Solution Approach 2:
The crack detection ring acts as an intermediary structure between the inner first seal-ring and the outer second seal-ring. It provides a dedicated pathway for crack detection without interfering with the sealing functions of the inner and outer rings, thus improving detection capability while maintaining structural organization.
2Measurement precision
If controllers and operators are added to provide and compare current/voltage for crack detection, then crack detection precision is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The controllers and operators perform multiple functions: they provide current or voltage to the crack detection ring, measure the electrical properties, compare with reference values, and detect cracks. This multi-functionality reduces the need for separate dedicated components for each function, thereby improving detection precision while limiting the increase in overall device complexity.
3Reliability
If existing crack detection technologies are used, then device structure remains simple, but crack detection precision and reliability are insufficient
Solution Approach 1:
The crack detection ring is pre-configured with electrical connection paths and the controllers are pre-programmed with reference values for comparison. This preliminary setup ensures that when a crack occurs, the detection system is already in place and ready to immediately detect and locate the crack, improving reliability without requiring complex real-time adjustments.
Data Source
AI summary
A semiconductor device includes a crack detection ring and a crack detection structure. The semiconductor device comprises a first seal-ring surrounding a circuit region; a crack detection ring surrounding the first seal-ring; a second seal-ring surrounding the first seal-ring and the crack detection ring; a connection part connecting the first seal-ring and the crack detection ring; and a crack detection structure disposed in the circuit region and electrically connected to the crack detection ring.