Crack-Filled Ni-P Metal Wiring for Flexible Transistor Bending
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Solution Overview
Problem
Conductive metal wiring on flexible substrates experiences increased resistance and potential disconnection when bent, due to cracking of nickel-phosphorus layers used in transistor manufacturing, which affects the conductivity and reliability of flexible organic transistors.
Innovation Solution
A method involving the formation of a nickel-phosphorus layer on a substrate via electroless plating, followed by intentionally creating cracks in the layer and subsequently filling these cracks with gold or copper using a displacement plating bath, resulting in a multi-layer structure that maintains conductivity even after bending.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a nickel-phosphorus layer is formed on a flexible substrate using electroless plating, then the substrate can be bent at lower temperatures suitable for flexible substrates, but the layer cracks when bent causing increased resistance and potential disconnection
Solution Approach 1:
The patent applies composite materials by combining nickel-phosphorus layer with gold or copper layers to create a multi-layer metal wiring structure. The nickel-phosphorus layer provides low-temperature processability while the gold/copper layers provide crack resistance and maintained conductivity after bending, thus resolving the contradiction between processing temperature and conductivity reliability.
Solution Approach 2:
The patent segments the metal wiring into multiple functional layers: a nickel-phosphorus layer for low-temperature formation and adhesion, and outer gold or copper layers for conductivity and crack resistance. This segmentation allows each layer to perform its specific function, resolving the contradiction between bendability and conductivity maintenance.
2Device complexity
If a single-layer nickel-phosphorus wiring is used on flexible substrate, then the manufacturing process is simple, but the wiring experiences increased resistance and disconnection when bent
Solution Approach 1:
The patent uses composite materials by combining nickel-phosphorus layer with gold or copper layers. The nickel-phosphorus layer provides adhesion and low-temperature processability, while the gold/copper layers provide crack resistance and maintained conductivity during bending, thus resolving the contradiction between structural complexity and conductivity reliability.
Solution Approach 2:
The patent applies local quality by assigning different materials to different functional requirements: nickel-phosphorus for adhesion and low-temperature processing, gold/copper for conductivity and crack resistance. This localized material selection optimizes each region's performance while maintaining overall reliability during bending.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method ensures a resistance increase rate of 7.0% or less after 100 bending cycles, maintaining conductivity and preventing disconnection, thus enhancing the reliability of metal wiring and flexible transistors.
Implementation Method 1
chemical plating (electroless plating), which is a plating method that utilizes reduction due to contact action on the material surface
Implementation Method 2
bringing a displacement gold plating bath or a displacement copper plating bath into contact with the first layer having the crack to form a second layer containing gold or copper
Data Source
AI summary
Provided is a method of manufacturing a metal wiring on a substrate, including the steps of: forming a first layer containing a first material in at least part on the substrate; forming a crack in the first layer to form the first layer having the crack; and forming a second layer containing a second material in the first layer having the crack.