Crank-Shape UWB Antenna via 3D Substrate Integration
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Solution Overview
Problem
Existing UWB mobile terminal antennas require compact, lightweight designs with planar structures and stable directivity across a wide frequency range, but current solutions fail to adequately address fluctuations in directivity and broadband properties.
Innovation Solution
The antenna device features a substrate with conductive layers and through hole conductors arranged in crank or helical forms, connecting multiple conductive cells across both surfaces, forming a compact and broadband structure that maintains stable directivity across frequencies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple antenna elements are positioned on a printed wiring board to adjust directivity, then directivity adjustment capability is improved, but device complexity increases
Solution Approach 1:
The patent transitions from planar 2D antenna element arrangement to 3D spatial configuration by forming conductive layers in crank shapes that extend through the substrate thickness. This dimensional change enables directivity control without requiring multiple separate antenna elements, thus reducing device complexity while maintaining adaptability
Solution Approach 2:
The conductive layers are nested within the substrate structure, with first and second conductive layers positioned on opposite surfaces and connected through via conductors. This nesting approach integrates the antenna elements within the substrate rather than placing them externally, reducing overall device complexity while preserving directivity adjustment capability
2Ease of manufacture
If a compact planar structure is used for easy installation, then ease of manufacture is improved, but broadband properties deteriorate
Solution Approach 1:
The patent achieves broadband properties by extending conductive paths in the third dimension through crank-shaped configurations that wrap around via conductors. This 3D structure increases the effective electrical length and bandwidth without compromising the compact planar footprint required for easy installation
Solution Approach 2:
The conductive layers are formed with curved crank shapes rather than straight lines, allowing the antenna elements to occupy more space efficiently within the planar constraint. This curvature enables longer effective radiating paths and broader frequency response while maintaining compact installation-friendly dimensions
3Adaptability or versatility
If through hole conductors are used to connect conductive layers in crank form, then broadband properties are improved, but manufacturing precision requirements increase
Solution Approach 1:
The antenna structure is segmented into discrete conductive layers connected by via conductors at specific positions. This segmentation allows independent optimization of each layer's crank shape while using standardized via holes, reducing overall manufacturing precision requirements compared to continuous 3D structures
Solution Approach 2:
The via conductors serve as intermediaries that connect the first and second conductive layers, enabling the crank-shaped configuration without requiring direct 3D printing or complex machining. This intermediary approach uses standard PCB via technology, maintaining reasonable manufacturing precision requirements while achieving broadband performance
Data Source
AI summary
An antenna device has a substrate having a first surface and a second surface on the opposite side of the first surface, a first-surface-side conductive layer formed on the first surface of the substrate, a second-surface-side conductive layer formed on the second surface of the substrate, and through hole conductors connecting the first-surface-side conductive layer and the second-surface-side conductive layer. The first-surface-side conductive layer and the second-surface-side conductive layer are formed such that the first-surface-side conductive layer and the second-surface-side conductive layer are connected via the through hole conductors in a crank form from the first surface to second surface of the substrate.