Crank-Shaped Spring Interconnections for Warpage Tolerance
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Solution Overview
Problem
Designing electrical interconnections between integrated circuit packages and circuit boards is challenging due to factors like package warpage and manufacturing tolerances, which can degrade connection quality and make it difficult to achieve reliable signal integrity and power delivery.
Innovation Solution
The use of crank-shaped, rod-and-spring, and volute spring-based interconnections that incorporate mechanical components like collars, pins, and conductive materials to form shorter, more reliable electrical paths with increased pin stroke and distributed compliant mechanisms, allowing for improved contact and reduced stress on the connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional rigid interconnections are used, then manufacturing is simple, but package warpage and manufacturing tolerances degrade electrical connections
Solution Approach 1:
The patent changes the physical state and mechanical properties of the interconnection by introducing compliant mechanisms with specific spring constants and stroke lengths. The compliant mechanism transforms the rigid interconnection into a flexible one that can accommodate warpage and tolerances while maintaining reliable electrical connections.
Solution Approach 2:
The patent employs a compliant mechanism consisting of flexible beams and springs that can bend and deform to accommodate package warpage and manufacturing tolerances. This flexible structure maintains continuous electrical contact despite dimensional variations in the package assembly.
2Reliability
If pin length is increased to accommodate warpage, then connection reliability improves, but interconnection profile increases
Solution Approach 1:
The patent introduces a dynamic compliant mechanism that can adapt its configuration based on the degree of warpage or misalignment. The mechanism includes movable components that can deflect and reposition to maintain optimal contact, providing connection reliability without requiring a permanently increased pin length.
Solution Approach 2:
The interconnection is divided into multiple segments including compliant beams, springs, and contact elements. This segmentation allows each component to independently accommodate specific types of deformation while maintaining the overall electrical connection, achieving reliability without increasing the total profile.
3Reliability
If spring mechanisms are added to maintain pin force, then electrical connection quality improves, but device complexity increases
Solution Approach 1:
The patent combines the electrical contact function and the compliance function into a single integrated compliant mechanism. The spring-loaded contact element simultaneously provides electrical connection and accommodates warpage, eliminating the need for separate mechanical support structures and reducing overall device complexity.
Solution Approach 2:
The compliant mechanism serves multiple functions: it provides electrical connection, accommodates warpage and tolerances, maintains contact force, and enables signal integrity. This multi-functionality reduces the need for additional components and simplifies the overall device architecture.
4Reliability
If pin stroke is increased to accommodate tolerances, then connection reliability improves, but pin length must increase
Solution Approach 1:
The patent employs a dynamic compliant mechanism with spring elements that can deflect through a large stroke range to accommodate manufacturing tolerances and package warpage. The spring constant is optimized to provide sufficient contact force throughout the entire stroke range, maintaining reliable electrical connection without requiring a proportionally increased pin length.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
These interconnections provide a lower profile with enhanced signal integrity and power delivery, maintaining contact quality even with thinner devices and under conditions of package warpage and manufacturing tolerances, by distributing stress and maintaining adequate pin force without increasing length or decreasing force.
Implementation Method 1
interconnections featuring a crank-shaped spring, rod and spring, or volute spring mechanisms that provide a distributed compliant mechanism
Implementation Method 2
allowing for a larger pin stroke without increasing the pin length or decreasing the pin force
Data Source
AI summary
Some embodiments described herein include apparatuses and methods of forming such apparatuses. In one such embodiment, an apparatus may include an electronic arrangement, a first die, and a second die coupled to the first die and the electronic arrangement. The electronic arrangement may include an opening. At least a portion of the die may occupy at least a portion of the opening in the electronic arrangement. Other embodiments including additional apparatuses and methods are described.