Crescent Moon Phosphor for Light Distribution Control

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Solution Overview

Problem

Conventional light emitting device packages face challenges in controlling light distribution, leading to mura and yellow ring phenomena due to the dispersion of fluorescent materials, and require separate phosphor sheets for each device, limiting manufacturing versatility.

Innovation Solution

A light emitting device package design featuring a substrate with a reflecting member and a transparent encapsulant containing a concave phosphor accommodating space, where the phosphor is shaped to have a crescent moon cross-section, optimizing light distribution and preventing peeling phenomena without the need for a separate phosphor sheet.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If a phosphor is formed by dispensing a fluorescent material mixed with an epoxy inside a reflector cup, then the light distribution curve width is increased, but it becomes difficult to control light and causes mura and yellow ring phenomena

Engineering Contradiction:
Improvelight distribution curve widthVSAvoidlight control difficulty
Core Design Contradiction:
Area of stationary objectVSEase of operation

Solution Approach 1:

The phosphor layer is designed with non-uniform thickness, being thicker at the center and thinner at the edges, to create different optical properties in different regions. This local variation in phosphor thickness compensates for the natural spreading of light, maintaining a controlled light distribution curve width while preventing mura and yellow ring phenomena.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The invention transitions from controlling light distribution in two dimensions (horizontal spread) to controlling it through the third dimension (vertical thickness variation). By varying the phosphor thickness in the vertical dimension, the patent achieves precise control over the light distribution curve width without increasing it excessively.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Ease of manufacture

If a phosphor shaped like a sheet and the same thickness is attached to the light emitting device, then the manufacturing process is simplified, but a peeling phenomenon is generated at the boundary surface

Engineering Contradiction:
Improvemanufacturing process simplicityVSAvoidphosphor attachment stability
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The phosphor layer transitions from uniform thickness to non-uniform thickness, being thicker at the center and thinner at the edges. This design ensures that the phosphor naturally tapers toward the boundary surfaces, eliminating air gaps and foreign substances that cause peeling, while maintaining firm attachment across the entire surface.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

Instead of attaching a phosphor sheet of uniform thickness that creates peeling at the edges, the invention inverts the approach by using a phosphor layer that is inherently thinner at the edges. This inversion of the thickness profile prevents the peeling phenomenon that occurs with uniform thickness sheets.

Inventive Principle:
Principle #13The other way round (Inversion)

3Reliability

If separate phosphor sheets for each light emitting device are ordered and manufactured in advance, then the peeling phenomenon is prevented, but the production line versatility is limited

Engineering Contradiction:
Improvephosphor attachment stabilityVSAvoidproduction line versatility
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

The invention merges the phosphor application process with the standard LED packaging process. The phosphor is applied directly to the LED chip during the normal manufacturing sequence using existing equipment, eliminating the need for separate phosphor sheet manufacturing and attachment steps. This integration maintains reliable phosphor attachment while enabling the production line to handle various LED standards.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The phosphor application method is designed to be universal, working with different LED chip sizes and configurations without requiring dedicated phosphor sheets for each standard. The direct application process using existing packaging equipment provides multi-functionality across various production lines.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances light control, prevents mura and yellow ring phenomena, ensures phosphor fixation, and allows for versatile application across various standards without requiring a separate phosphor sheet, improving manufacturing efficiency and durability.

Implementation Method 1

a transparent encapsulant charged in the reflector cup of the reflecting member in a flow state and hardened

Methodology Applied
Scientific EffectHardening: Phase Change

Implementation Method 2

a phosphor charged in the phosphor accommodating space in a flow state and hardened

Methodology Applied
Scientific EffectHardening: Phase Change

Implementation Method 3

The phosphor may have a crescent moon shape in which a cross section at a center portion is thick and a cross section at a boundary portion is thin, and have a larger length than a width of the light emitting device

Methodology Applied
Scientific EffectLight distribution control: Refraction

Data Source

PatentUS10062809B2Light emitting device package, backlight unit, lighting device and its manufacturing method
Publication Date: 2018.08.28 LUMENS CO LTD
  • US10062809B2 patent drawing
  • US10062809B2 patent drawing
  • US10062809B2 patent drawing

AI summary

Disclosed are a light emitting device package, a backlight unit, and a lighting device which are usable for a display or lighting, and a method of manufacturing the light emitting device package. The light emitting device package includes: a substrate; a light emitting device seated on the substrate; a reflecting member provided on the substrate and provided with a reflector cup surrounding a lateral circumference of the light emitting device; a transparent encapsulant charged in the reflector cup of the reflecting member in a flow state and hardened, and provided with a concave phosphor accommodating space in an upper surface thereof; and a phosphor charged in the phosphor accommodating space in a flow state and hardened.