Crimp Quality Monitoring via Force Frequency Analysis
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Solution Overview
Problem
Existing crimp quality monitoring systems are inaccurate in identifying defective crimps, as they rely solely on crimp height or force profiles, which can fail to detect issues like insulation in the barrel or incorrectly identify good crimps as defective.
Innovation Solution
A crimping apparatus equipped with a force sensor and a controller that generates a frequency profile using a Fast Fourier Transform algorithm to analyze crimp forces, allowing for accurate identification of crimp defects by comparing frequencies against predetermined normal ranges.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If crimp quality is monitored based on crimp height, then the monitoring system is simple to implement, but defective crimps with correct height cannot be detected
Solution Approach 1:
The patent introduces force as an intermediary measurement parameter between the crimping process and quality assessment. Instead of directly measuring crimp height or appearance, the system measures crimping force during the process, which serves as a mediator that reflects the actual crimp quality and detects defects that visual or height measurements miss.
Solution Approach 2:
The patent replaces mechanical measurement systems (height gauges, visual inspection) with a force-based measurement system. By using force sensors to measure crimping forces and analyzing force profiles, the system substitutes traditional mechanical quality control methods with a more sensitive force-based approach that can detect subtle defects.
2Measurement precision
If crimp quality is monitored based on force profiles, then defect detection capability is improved, but the system produces false positives and incorrect identifications
Solution Approach 1:
The patent implements a learning phase before actual quality monitoring where the system collects force profile data from known good crimps and establishes baseline characteristics. This preliminary action allows the system to learn what normal force profiles look like, creating a reference framework that reduces false positives and improves the reliability of subsequent defect detections.
Solution Approach 2:
The patent analyzes multiple parameters from the force profile rather than relying on a single force measurement. By examining the entire force profile curve, multiple force values at different stages of the crimp stroke, and comparing them against learned baselines, the system uses partial information from the complete force data to make more accurate defect identification decisions.
3Productivity
If traditional monitoring methods are used, then the system operates quickly, but it cannot identify the particular type of crimp defect
Solution Approach 1:
The patent segments the force profile into multiple measurement points and stages during the crimp stroke. By dividing the continuous force data into discrete segments corresponding to different phases of the crimping process, the system can analyze specific portions of the force profile to identify particular defect types while maintaining efficient processing speed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables precise detection of crimp defects, distinguishing between various types of defects such as insulation, missing strands, or incorrect terminal/wire sizes, improving the reliability of crimp quality assessment.
Implementation Method 1
a force sensor detecting a crimp force during the crimp stroke
Implementation Method 2
The frequency transform algorithm may be a Fast Fourier Transform algorithm
Data Source
AI summary
A crimping apparatus includes a ram having crimp tooling for crimping a terminal to a wire during a crimp stroke and a force sensor detecting a crimp force during the crimp stroke. The crimping apparatus also includes a controller that monitors the crimp quality of a crimp based on a frequency profile of the crimp. Optionally, the controller may create the frequency profile based on a force profile using a frequency transform algorithm. The frequency transform algorithm may be a Fast Fourier Transform algorithm.