Automated Crimp Height Measurement Using Vision and Tactile Probes
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for measuring the crimp height of a conductor crimp are prone to errors due to operator variability and miniaturization challenges, making it difficult to achieve reliable and accurate measurements.
Innovation Solution
A measuring arrangement that incorporates a vision system with a camera and actuator to ensure the conductor crimp is properly positioned before measurement, using tactile probes and adjustable measuring tips, and compensates for perspective distortion to automate and enhance measurement accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If manual measurement methods (micrometer, digital dial indicator) are used to measure crimp height, then measurement accuracy can be sufficient, but operator errors and deliberate manipulations limit the reliability of achieving required measurement accuracy
Solution Approach 1:
The patent replaces manual mechanical measurement systems (micrometers, digital dial indicators operated by human hands) with an automated optical measurement system using a camera and image evaluation software. This substitution eliminates operator variability, deliberate manipulations, and positioning errors while maintaining high measurement precision through digital image analysis and automated calculation of crimp height from captured images.
Solution Approach 2:
The measurement system performs self-positioning and self-measurement through automated image capture and evaluation. The camera automatically captures images of the crimp contact, and the evaluation software automatically determines crimp height without requiring manual positioning or operation by a human operator, thereby eliminating operator errors and improving measurement reliability.
2Adaptability or versatility
If miniaturization of conductor crimps is increased to improve product design, then product performance improves, but it becomes even more difficult to carry out correct measurement and recognize erroneous measurements
Solution Approach 1:
The patent employs an optical measurement system with a camera and digital image evaluation to measure miniaturized conductor crimps. This system provides high measurement precision for small dimensions by capturing detailed images and using software to automatically calculate crimp height, eliminating the difficulty of manually measuring miniaturized components and recognizing measurement errors.
Solution Approach 2:
The system provides automated feedback through image capture and evaluation, allowing verification of correct measurement positioning. The camera captures images that can be evaluated to confirm proper positioning before measurement, and the automated evaluation process provides feedback on measurement results, enabling recognition of erroneous measurements even in miniaturized components.
3Reliability
If automated measurement systems are introduced to eliminate operator errors, then measurement reliability improves, but device complexity increases
Solution Approach 1:
The patent replaces complex manual measurement operations with a relatively simple optical system consisting of a camera and software-based image evaluation. This substitution achieves high measurement reliability by eliminating operator errors while keeping the physical device complexity low, as the system uses standard camera technology and software algorithms rather than complex mechanical measurement apparatus.
Data Source
Figure 1~3
Figure 4
Figure 5~10
AI summary
The measurement arrangement (50) comprises a camera (20) for recording an image of a crimp contact (30) in a measuring area (53), and a vision system for evaluation of the images. A measuring unit (1) is connected to the vision system for tactile measurement of the crimp height of the conductor crimp. The vision system comprises an evaluation and comparison unit, with which the actual position of the crimp contact is determined corresponding to the images captured by the camera and the actual position is compared with a desired position of the crimp contact. An independent claim is included for a method for determining crimp height of a conductor crimp of a crimp contact.