Crimp Terminal Serration Geometry for Stable Low-Resistance Contact
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Solution Overview
Problem
Conventional crimp terminals face challenges in stably reducing the resistance of the crimp portion due to the configuration of serrations, which often lead to increased resistance during the crimping process.
Innovation Solution
A crimp terminal design featuring a conductor crimp portion with serrations that extend in a groove shape over the conductor swage pieces and bottom plate, where the width of the serration opening is greater than the bottom face width, and the depth of the serration in the swage pieces is smaller than that of the bottom plate, preventing inward tilting and maintaining a stable width during crimping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If serrations are formed on the contact face to reduce resistance, then the electric resistance of the crimp portion is reduced, but the serration configuration causes instability in resistance reduction due to inward tilting during crimping
Solution Approach 1:
The patent changes the geometric parameters of the serration, specifically setting the opening width to be greater than the bottom face width and controlling the depth relationship between swage piece and bottom plate portions. This parameter optimization prevents inward tilting during crimping while maintaining effective contact with the conductor, thereby stabilizing resistance reduction.
Solution Approach 2:
The serration is designed with different depths in different locations: the portion in the bottom plate has a greater depth than the portion in the swage pieces. This local differentiation allows the serration to effectively tear the oxide film and contact the core wire while preventing inward tilting in the swage piece regions during crimping.
2Reliability
If the serration depth in swage pieces is increased to improve contact, then the resistance reduction effect is enhanced, but the serration becomes prone to inward tilting and shape deformation during crimping
Solution Approach 1:
The patent optimizes the serration depth parameter by making it smaller in the swage piece portions compared to the bottom plate portions. This controlled depth ensures sufficient contact quality to tear the oxide film and reach the core wire while preventing excessive deformation and inward tilting during the crimping process.
3Strength
If the serration opening width is reduced to concentrate force, then the oxide film tearing effect is improved, but the serration is more susceptible to shape change and inward tilting during crimping
Solution Approach 1:
The patent sets the serration opening width to be greater than the bottom face width, creating an optimized geometric configuration. This parameter choice balances the force concentration needed to tear the oxide film effectively while providing sufficient structural stability to prevent inward tilting and shape deformation during crimping.
Data Source
AI summary
A crimp terminal includes a conductor crimp portion that includes a bottom plate on which a conductor of an electric wire being disposed, and a pair of conductor swage pieces extending from both side edges of the bottom plate, the conductor crimp portion being crimped and connected to the conductor, by covering the conductor with the pair of conductor swage pieces and swaging the conductor. The conductor crimp portion includes a serration that extends in a groove shape over the pair of conductor swage pieces and the bottom plate, and in the serration, in a developed state before the conductor crimp portion is crimped to the conductor, a width of an opening of the serration is greater than or equal to a width of a bottom face of the serration.