Crimping Terminal Buffer Layer Fractal Particles
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Solution Overview
Problem
The existing technologies for crimping terminals face challenges in achieving a balance between low contact resistance and strong mechanical holding force without forming serrations, leading to complex molding die management, uneven particle distribution, and instability in electrical and mechanical connections.
Innovation Solution
A crimping terminal with a buffer layer comprising resin, plating, or grease and conductive microscopic particles with a fractal structure, which includes fine protrusions, is used to pierce the insulating coat and establish a stable connection with the conductive part of the electric wire, eliminating the need for serrations and simplifying molding die management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a concave-convex pattern (serration) is formed on the crimping terminal contact surface to increase mechanical holding force, then the contact pressure increases and electrical connection improves, but the molding die becomes complex and requires strict management
Solution Approach 1:
The patent extracts the functional effect of the concave-convex pattern from the molding die structure itself. Instead of forming serrations directly on the crimping terminal contact surface through complex molding dies, the invention applies a separate buffer layer with conductive particles that provides the same electrical and mechanical benefits without requiring complex die structures.
Solution Approach 2:
The buffer layer acts as an intermediary between the crimping terminal and the electric wire conductor. This intermediate layer contains conductive particles that pierce the insulating film and establish electrical contact, while also providing mechanical holding force through its adhesive matrix, thereby eliminating the need for complex serrated molding dies.
2Reliability
If conductive microscopic particles are coated on the electric wire before crimping to achieve low contact resistance, then electrical connection improves, but particle distribution becomes uneven and connection stability decreases
Solution Approach 1:
Instead of coating particles on the electric wire conductor before crimping (which leads to uneven distribution), the invention inverts the approach by incorporating the conductive particles into a buffer layer that is applied to the crimping terminal contact surface. This reversal of the coating target ensures uniform particle distribution and stable electrical connection.
Solution Approach 2:
The buffer layer is formulated as a composite material consisting of conductive particles dispersed in an adhesive matrix (resin, grease, or plating). This composite structure ensures uniform particle distribution throughout the layer while providing both electrical conductivity and mechanical adhesion, solving the particle distribution uniformity problem.
3Reliability
If a buffer layer with conductive particles is used instead of serrations to achieve low contact resistance, then electrical connection improves, but mechanical holding force may be insufficient
Solution Approach 1:
The buffer layer is designed as a composite material where conductive particles provide electrical conductivity while the adhesive matrix (resin, grease, or plating) provides mechanical strength and holding force. This composite structure simultaneously achieves low contact resistance and strong mechanical attachment without requiring serrations.
Solution Approach 2:
The buffer layer provides localized electrical conductivity through conductive particles at the contact interface, while the surrounding adhesive matrix provides mechanical holding force. This local differentiation of properties allows the same layer to fulfill both electrical and mechanical functions effectively.
4Reliability
If multiple types of molding dies are prepared for different electric wire conditions to form appropriate serrations, then connection performance is optimized, but manufacturing cost increases
Solution Approach 1:
The buffer layer with conductive particles serves as a universal solution that can be applied to various electric wire types and conditions without requiring different molding dies. The same buffer layer formulation provides optimized connection performance across different applications, eliminating the need for multiple specialized die sets and reducing manufacturing costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables a crimping terminal to achieve low contact resistance and strong mechanical holding force without serrations, improving connection stability and reducing manufacturing costs by simplifying the molding die process and ensuring consistent particle distribution.
Implementation Method 1
The microscopic particle in the buffer layer pierces an insulating coat on a surface of the conductive part and contacts the conductive part
Implementation Method 2
the microscopic particle comprises a fractal structure comprising a fine protrusion on a surface of the microscopic particle
Data Source
AI summary
A crimping terminal includes a crimping part that is compressed to a conductive part of an electric wire, and a buffer layer formed on a surface where the crimping part contacts the conductive part. The buffer layer includes a resin, a plating or a grease and a conductive microscopic particle that is mixed and dispersed therein. The microscopic particle includes a fractal structure including a fine protrusion on a surface of the microscopic particle.