Spatial Cross Bonding Wire Layout for Power Module Reliability
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Solution Overview
Problem
The reliability of bonding wires in power modules is compromised due to fatigue caused by fluctuating stress from electromagnetic forces, leading to reduced service life and impaired bonding effectiveness as power modules evolve towards higher power density.
Innovation Solution
The implementation of a spatial cross wire bonding structure where the lead paths of bonding wires form angles with each other, reducing electromagnetic forces and alleviating fatigue through intersection points on a preset plane.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If bonding wires are arranged in parallel or close proximity to achieve compact packaging, then power density is improved, but electromagnetic forces between wires increase causing fatigue and reduced service life
Solution Approach 1:
The patent transitions from planar parallel wire arrangement to three-dimensional spatial cross arrangement. The bonding wires are configured to cross each other in space, with projection lines on a preset plane intersecting at least at one point. This dimensional change allows wires to maintain close proximity for compact packaging while forming angles that reduce electromagnetic force interactions, thereby resolving the contradiction between power density and reliability.
2Reliability
If bonding wires are arranged in spatial cross configuration to reduce electromagnetic forces, then bonding wire reliability is improved, but packaging complexity increases
Solution Approach 1:
The patent introduces dynamic adaptability in wire routing by allowing flexible configuration of bonding wire paths. The wires can be arranged in various spatial cross patterns depending on specific packaging requirements, with the only constraint being that their projections must intersect on a preset plane. This dynamic approach enables reliability improvement through angular arrangement while maintaining packaging flexibility and avoiding excessive complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach prolongs the service life of bonding wires and ensures maximum bonding effectiveness by weakening electromagnetic forces, thereby enhancing the reliability of power module connections.
Implementation Method 1
spatial cross wire bonding is performed on bonding wires, so that lead paths of the bonding wires form an angle with each other, thereby weakening electromagnetic force between the bonding wires
Data Source
AI summary
A bonding structure and a power device. The bonding structure includes a first power unit and at least two bonding wires. At least one end of the bonding wire is connected to the first power unit through bonding. Projections that are of lead paths of the at least two bonding wires and that are on a preset plane have at least one intersection point. Spatial cross wire bonding is performed on the bonding wires, so that lead paths of the bonding wires form an angle with each other, thereby weakening electromagnetic force between the bonding wires. Therefore, fatigue due to fluctuating stress of the bonding wires can be alleviated, service lives of the bonding wires can be prolonged, and bonding effect can be ensured to a maximum extent.