Cross-Die On-Die Termination Control for Signal Reflection Reduction
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Solution Overview
Problem
Existing termination resistors on motherboards fail to prevent signal reflection caused by stub lines connected to components on module cards, leading to unintended noise in signals.
Innovation Solution
A semiconductor die is configured to control on-die termination (ODT) of another semiconductor die, reducing power consumption and simplifying system design by integrating termination resistors within the semiconductor chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If termination resistors are disposed on the motherboard, then signal reflection can be reduced, but the number of resistor elements and wiring complexity increase
Solution Approach 1:
The patent combines the termination resistor function with the semiconductor die by integrating ODT circuits directly into the die structure. This merging eliminates the need for separate resistor elements on the motherboard and reduces wiring complexity while maintaining signal reflection reduction capabilities.
Solution Approach 2:
The patent transitions the termination resistor from a two-dimensional PCB layout to a three-dimensional integrated structure within the semiconductor die. This dimensional change moves the termination function from the board level to the chip level, reducing external wiring requirements.
2Reliability
If termination resistors are disposed on the motherboard, then signal reflection can be reduced, but the number of resistor elements increases
Solution Approach 1:
The patent combines the termination resistor function with the semiconductor die by integrating ODT circuits directly into the die structure. This merging eliminates the need for separate resistor elements on the motherboard while maintaining signal reflection reduction capabilities.
Solution Approach 2:
The semiconductor die performs multiple functions including both signal processing and termination resistance functions through the integrated ODT circuits. This multi-functionality eliminates the need for dedicated termination resistor elements on the motherboard.
3Use of energy by moving object
If ODT control signals are transmitted between semiconductor dies, then power consumption is reduced, but additional signal lines are required
Solution Approach 1:
The patent implements preliminary action by having the transmitting die generate and send ODT control signals to the receiving die before data transmission begins. This allows the receiving die to pre-configure its ODT circuits, reducing power consumption during actual data transmission.
Solution Approach 2:
The patent uses dedicated ODT control signal lines as intermediaries to coordinate between transmitting and receiving dies. These control signals enable the receiving die to activate ODT only when needed, reducing overall power consumption while managing the additional signal line requirement.
Data Source
AI summary
A semiconductor die includes a first pin configured to output a first on-die termination (ODT) control signal to a second semiconductor die, the second semiconductor die comprising a plurality of second ODT circuits each having an ODT that is responsive to the first ODT control signal; and a second pin configured to receive a second ODT control signal output from the second semiconductor die, the semiconductor die comprising a plurality of first ODT circuits each having an ODT that is responsive to the second ODT control signal.