Cross-Fab OHT Wafer Transfer Without Interface Devices
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Solution Overview
Problem
Existing automated material handling systems (AMHS) in semiconductor fabrication facilities face inefficiencies in cross-fab and cross-phase transfers due to the need for interface devices, which increase transportation volume and require additional clean room space, leading to traffic jams and reduced efficiency.
Innovation Solution
A unified control unit coordinates AMHSs across multiple fabrication facilities to facilitate direct transfer of payload containers between OHT systems without the use of intermediate interface devices, utilizing synchronized vehicles that align and transfer payloads directly, thereby optimizing the transportation process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If interface devices are used for cross-fab transfers, then payload transfer between OHT systems is enabled, but transportation volume increases and traffic congestion occurs
Solution Approach 1:
The patent removes interface devices from the cross-fab transfer system, extracting the problematic intermediate component that caused traffic congestion. Vehicles from different OHT systems transfer payloads directly by aligning and docking with each other, eliminating the need for intermediate interface devices and reducing transportation volume.
Solution Approach 2:
The patent introduces a unified control unit as a mediator that coordinates and synchronizes vehicles from different OHT systems. This mediator enables direct vehicle-to-vehicle payload transfer by managing alignment, docking, and transfer timing, replacing the traditional intermediary interface devices with a control-based coordination mechanism.
2Adaptability or versatility
If interface devices are used for cross-fab transfers, then payload transfer between OHT systems is enabled, but additional clean room space is required
Solution Approach 1:
The patent extracts and removes interface devices from the system, eliminating the stationary infrastructure that consumed additional clean room space. The transfer function is achieved through mobile vehicles docking with each other, requiring no permanent interface installations.
Solution Approach 2:
The patent transitions from static interface devices to dynamic vehicle-to-vehicle transfers. The transfer capability is embodied in the mobile vehicles themselves, which can align and dock at various positions along the OHT tracks, eliminating the need for fixed interface device locations.
Data Source
AI summary
System and method for cross-fab wafer transportation are provided. A method includes providing a first FAB building and a second FAB building connected via a bridging area, the second FAB building comprising fabrication tools configured to perform fabrication processes different than fabrication processes performed by fabrication tools in the first FAB building, after performing fabrication processes in the first FAB building, configuring a first vehicle of the first FAB building to travel along a first OHT track and take the wafer to the bridging area, configuring a second vehicle of the second FAB building to travel along a second OHT track and arrive at the bridging area, where a portion of the first OHT track is in parallel with a portion of the second OHT track at the bridging area, when some predetermined conditions are met, configuring the first vehicle to transfer the wafer to the second vehicle.