Multi-Port Cross-Flow Chamber Exhaust for Uniform Cleaning
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Solution Overview
Problem
Conventional semiconductor processing chambers suffer from inefficient cleaning of contaminants due to asymmetric exhaust ports, leading to incomplete removal of unwanted deposits and potential contamination of chamber components, which can result in performance reductions and substrate defects.
Innovation Solution
A port adapter system with carefully spaced apertures and independently controllable valves is used to uniformly distribute a cleaning gas across the processing chamber, allowing for tailored flow paths and improved gas removal efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If conventional asymmetric exhaust ports are used, then gas removal speed is improved, but cleaning uniformity deteriorates
Solution Approach 1:
The exhaust system is segmented into multiple aperture groups (first, second, third groups) with different orientations and positions around the chamber. Each group removes gas from specific regions, enabling both high-speed removal and uniform cleaning coverage through distributed exhaust points rather than a single asymmetric port
Solution Approach 2:
Different aperture groups are positioned to address specific local cleaning needs in different chamber regions. The first group addresses one region, the second group addresses another region, and the third group addresses a third region, allowing tailored gas removal and cleaning for each local area to achieve overall uniformity
2Reliability
If cleaning gas is released into the chamber body, then contaminant removal is improved, but incomplete cleaning of certain parts occurs
Solution Approach 1:
The cleaning process is segmented into multiple simultaneous flow paths through different aperture groups positioned at various orientations. This ensures that cleaning gas reaches all chamber surfaces including previously inaccessible areas, achieving complete and uniform cleaning without missing contaminated regions
Solution Approach 2:
The aperture groups are positioned at different orientations and spatial locations around the chamber, adding dimensional diversity to the gas flow paths. This multi-dimensional distribution of exhaust points ensures comprehensive coverage of all chamber surfaces from multiple angles, eliminating blind spots in the cleaning process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system ensures more uniform and complete cleaning of the chamber, reducing contaminants and preventing substrate defects by ensuring all chamber surfaces are evenly exposed to the cleaning gas, thereby enhancing processing quality and yield.
Implementation Method 1
The cleaning gas may react with the contaminants and be subsequently exhausted out of the chamber body
Implementation Method 2
The cleaning gas may react with the contaminants and be subsequently exhausted out of the chamber body through an exhaust system
Data Source
AI summary
A processing chamber and port adaptor are provided. Processing chambers include a chamber body having a lid coupled to the first end of the chamber body, a gas ring adjacent the first end of the chamber body, and a substrate support, where a processing region is defined between the substrate support and the lid. The processing chamber includes a port adapter coupled to the second end of the chamber body. The port adapter includes a body defining a plurality of apertures in fluid communication with the processing region, where each of the apertures are spaced apart along the body such that a distance between adjacent apertures is within about 20% of an average aperture spacing distance, an individually controllable valve fluidly coupled to one or more of the plurality of apertures, and an exhaust system in fluid communication with a system foreline and the plurality of apertures.