Cross-flow redundant air cooling for electronics

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Solution Overview

Problem

Electronic assemblies in compact environments, such as aircraft, face overheating issues due to limited space, making it challenging to dissipate thermal energy without directed air flow, and existing cooling systems are unreliable in case of fan failure.

Innovation Solution

A dual-air-flow electronic assembly cooling system with separate air drivers and ducts to ensure continuous cooling, using convective and conductive heat transfer through a module case assembly, providing redundancy in case one air flow fails.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a single air driver is used to cool electronic assemblies, then the cooling system is simple, but the system becomes unreliable when the air driver fails

Engineering Contradiction:

Improvecooling system reliabilityVSAvoidcooling system complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The cooling system is divided into two independent air drivers (first air driver and second air driver) that operate separately to cool the electronic assembly from opposite sides. This segmentation allows one driver to fail without compromising the entire cooling system, directly resolving the reliability issue while maintaining manageable complexity through modular design

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent implements redundant cooling capacity by positioning the electronic assembly between two air drivers with both drivers operational before any failure occurs. This beforehand cushioning ensures that if one air driver fails, the other is already in place to maintain cooling, preventing overheating and system failure

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

2Volume of moving object

If electronic assemblies are placed in close proximity to maximize space utilization, then space efficiency improves, but heat dissipation becomes difficult without directed air flow

Engineering Contradiction:

Improvespace utilizationVSAvoidheat dissipation

Core Design Contradiction:

Volume of moving objectVSTemperature

Solution Approach 1:

Instead of attempting to dissipate heat in the horizontal plane where components are densely packed, the patent introduces vertical air flow dimensions by directing air from above and below the electronic assembly through the module case wall. This dimensional approach to heat dissipation allows effective cooling in compact vertical spaces without requiring increased horizontal spacing between components

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Temperature

If directed air flow is used to cool electronic assemblies in compact environments, then heat dissipation effectiveness improves, but the system becomes vulnerable to overheating if air flow is halted

Engineering Contradiction:

Improveheat dissipation effectivenessVSAvoidcooling system reliability

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The system is configured with both air drivers operational and positioned before any failure occurs, creating a cushion of redundant cooling capacity. If one air driver halts, the other is already in place to maintain adequate heat dissipation, preventing the overheating condition that would otherwise result from sudden loss of directed air flow

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Ensures effective cooling of electronic assemblies even if one air flow is halted, maintaining operational stability and preventing overheating in critical environments like aircraft.

Implementation Method 1

direct air driven by the first air driver past the module case wall in-front of the module case wall to effectively cool the electronic assembly via convective heat transfer

Methodology Applied

Scientific EffectConvective heat transfer: Convection

Implementation Method 2

transfer the thermal energy conducted from the electronic assembly from in-front of the module case wall to in-back of the module case wall

Methodology Applied

Scientific EffectConductive heat transfer: Conduction (thermal)

Implementation Method 3

transfer the thermal energy conducted from the electronic assembly from in-front of the module case wall to in-back of the module case wall to the air driven by the second air driver via conductive heat transfer

Methodology Applied

Scientific EffectConductive heat transfer: Conduction (thermal)

Data Source

PatentUS7307840B2Cross-flow redundant air cooling method for high reliability electronics

Publication Date: 2007.12.11 SMITHS AEROSPACE INC

AI summary

An electronic assembly cooling system including a module case assembly that has a module case wall. The system includes a first and second air driver and an electronic assembly located in-front of the module case wall. The system conducts thermal energy from the electronic assembly from in-front of the module case wall to in-back of the module case wall, and directs air driven by the first air driver past the module case wall in-front of the module case wall to cool the electronic assembly via convective heat transfer. The system directs air driven by the second air driver past the module case wall in-back of the wall to transfer the thermal energy conducted from the electronic assembly from in-front of the module case wall to in-back of the module case wall to the air driven by the second air driver via conductive heat transfer to cool the electronic assembly.