Cross-Layer Conductive Patterns in Additive Manufacturing
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Solution Overview
Problem
Current additive manufacturing techniques face challenges in creating complex cross-layer patterns with conductive materials, particularly in forming interconnected conductive elements within non-conductive layers, which is essential for embedding electronic devices and ensuring electrical connectivity.
Innovation Solution
The method involves dispensing patterning material to form cross-layer patterns by creating open cavities and using conductive ink to establish electrical connections between layers, with sintering inducing agents to consolidate conductive particles, allowing for the formation of conductive paths across multiple layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Extent of automation
If conventional additive manufacturing techniques are used to deposit conductive materials layer by layer, then the fabrication process can be automated, but the ability to form interconnected conductive elements across non-conductive layers is limited
Solution Approach 1:
The patent applies preliminary action by forming open cavities in non-conductive layers before depositing conductive pattern elements. This pre-prepared structure ensures that conductive materials can be properly positioned and interconnected across layers, solving the reliability issue while maintaining automation through programmed cavity formation and material deposition sequences
2Manufacturing precision
If complex cross-layer patterns are fabricated using traditional methods, then manufacturing precision can be achieved, but the process complexity and difficulty increase significantly
Solution Approach 1:
The patent segments the fabrication process into distinct operational phases: forming non-conductive layers with integrated cavities, depositing conductive pattern elements, and repeating the sequence. This segmentation simplifies the overall process by breaking down complex cross-layer patterning into manageable, automatable steps while maintaining manufacturing precision through controlled material deposition and cavity alignment
3Ease of manufacture
If conductive particles are deposited without sintering inducing agents, then the deposition process is simpler, but the conductive particles remain loose and lack structural integrity
Solution Approach 1:
The patent introduces sintering inducing agents as intermediary substances that facilitate the transformation of loose conductive particles into structurally intact conductive patterns. These agents act as mediators between the simple deposition process and the final strong conductive structure, enabling particle consolidation without significantly complicating the manufacturing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the fabrication of three-dimensional objects with embedded electronic devices, ensuring electrical connectivity and enhancing the integration of conductive patterns within non-conductive layers, thereby facilitating the creation of functional electronic circuits.
Implementation Method 1
with sintering inducing agents to consolidate conductive particles
Data Source
AI summary
A method of fabricating a cross-layer pattern in a layered object is disclosed. The method is executed by an additive manufacturing system and comprises: dispensing a patterning material onto a receiving medium to form a first pattern element; dispensing a first layer of modeling material onto the first pattern element while forming a first open cavity exposing at least a portion of the first pattern element beneath the first layer; and dispensing patterning material onto the exposed portion of the first pattern element and the first layer to form a second pattern element contacting the first pattern element.