Cross Section Image Quality Correction in 3D Shape Measurement
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Solution Overview
Problem
The precision of 3D image construction and shape measurement in the ┌Cut & See┐ method using a composite charged particle beam device is compromised due to the need for angle correction in cross section images, leading to deteriorated measurement precision.
Innovation Solution
An apparatus and method that includes a focused ion beam column, an electron beam column, and an image quality corrector to control and correct the image quality of cross section images based on target irradiation positions and reference image quality information, ensuring accurate and uniform image quality for improved shape measurement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If cross sections are observed at an angle using the ┌Cut & See┐ method, then three-dimensional observation capability is improved, but measurement precision is deteriorated due to angle correction requirements
Solution Approach 1:
Instead of observing cross sections at an angle and then correcting the images, the invention inverts the approach by directing the electron beam perpendicular to the cross section surface. This eliminates the need for angle correction and directly provides accurate measurement data, while still enabling 3D observation through sequential cross-sectioning.
Solution Approach 2:
The invention changes the critical parameter of electron beam incidence angle from oblique (conventional) to perpendicular (90 degrees). This parameter change eliminates distortion in cross section images, allowing direct measurement without correction while maintaining the ability to construct 3D images from multiple cross sections.
2Adaptability or versatility
If angle correction is applied to cross section images, then three-dimensional image construction is enabled, but image quality and measurement accuracy are compromised
Solution Approach 1:
The invention performs preliminary action by ensuring the electron beam is perpendicular to the cross section surface before image acquisition. This preventive measure eliminates distortion at the source, avoiding the need for post-processing angle correction that degrades image quality.
Solution Approach 2:
The invention creates accurate copies of the true cross section morphology by using perpendicular electron beam incidence. This direct copying approach without angular distortion preserves image fidelity, allowing high-quality 3D reconstruction from accurate 2D cross section images.
3Adaptability or versatility
If multiple cross section images are obtained at predetermined angles, then internal structure observation is improved, but 3D image precision is deteriorated
Solution Approach 1:
The invention segments the sample into multiple cross sections and observes each perpendicular to its surface. This segmentation approach allows comprehensive internal structure observation while maintaining high precision in each individual cross section image, which when layered produce accurate 3D images without angle correction errors.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the precision of shape measurement by correcting image quality issues, resulting in more accurate 3D image construction and improved measurement precision.
Implementation Method 1
exposes a cross section of a sample by irradiating the sample with a focused ion beam
Implementation Method 2
an electron detector detecting secondary electrons or reflection electrons generated from the sample
Implementation Method 3
an electron beam column irradiating the sample with an electron beam
Data Source
AI summary
An apparatus for processing and observing a cross-section includes: a sample bed holding a sample; a focused ion beam column radiating a focused ion beam to the sample; an electron beam column radiating an electron beam to the sample, perpendicularly to the focused ion beam; an electron detector detecting secondary electrons or reflection electrons generated from the sample; a irradiation position controller controlling irradiation positions of the focused ion beam and the electron beam based on target irradiation position information showing target irradiation positions of beams on the sample; a process controller controlling a cross-section-exposing process that exposes a cross-section of the sample by radiating the focused ion beam to the sample and a cross-section image-obtaining process that obtains a cross-section image of the cross-section by radiating the electron beam to the cross-section; and an image quality corrector correcting image quality of the cross-section image obtained.