Cross-Shape Transfer Blade for Thin Wafer Support
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Solution Overview
Problem
Existing workpiece transfer systems in semiconductor manufacturing, which rely on traditional transfer blades mounted on robot arms, often result in defects or damage to thin workpieces due to uneven distribution of forces and contact areas during transportation and support.
Innovation Solution
The use of a cross-shape transfer blade with angled prongs and additional wing structures provides more points of contact and support, distributing forces more evenly across the workpiece, thereby minimizing the risk of defects or damage during transfer and support.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a traditional transfer blade is used to transport thin workpieces, then the workpiece can be transferred between processing apparatuses, but the workpiece is prone to defects or damage due to uneven force distribution
Solution Approach 1:
The transfer blade is segmented into multiple support structures (first support structure, second support structure, third support structure) that contact different regions of the workpiece. This segmentation allows forces to be distributed across multiple discrete contact points rather than concentrated at a single location, reducing stress on any one area and preventing workpiece damage during handling and transport.
Solution Approach 2:
Different regions of the transfer blade are designed with locally optimized support structures tailored to specific workpiece regions. The first support structure contacts the first region, the second support structure contacts the second region, and the third support structure contacts the third region. This local quality approach ensures that each area of the workpiece receives appropriate support characteristics, improving overall handling reliability without compromising ease of operation.
2Stability of the object's composition
If gravity is used to maintain workpiece position on the transfer blade, then the workpiece remains stable during transport, but thin workpieces experience uneven force distribution leading to defects
Solution Approach 1:
The support system is divided into multiple discrete support structures positioned at different locations on the transfer blade. Each support structure independently manages gravitational forces acting on its corresponding workpiece region. This segmentation transforms the single-point gravitational load into a distributed multi-point load system, maintaining position stability while preventing the uneven force concentration that causes defects in thin workpieces.
Solution Approach 2:
The support structures extend in multiple spatial dimensions across the transfer blade surface, creating a three-dimensional support network. This dimensional expansion allows gravitational forces to be counteracted at multiple heights and locations simultaneously, providing both positional stability and uniform force distribution across the workpiece thickness and surface area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The cross-shape transfer blade effectively reduces the likelihood of defects or damage to workpieces by ensuring even force distribution and minimizing contact area with the transfer blade, leading to improved handling and processing outcomes in semiconductor manufacturing.
Implementation Method 1
Typically, gravity maintains the position of the workpiece with respect to the robot blade. As such, gravity applies forces (e.g., downward forces based on the orientation of the workpiece when resting on the transfer or robot blade) on the workpiece when the workpiece is being transported, transferred, and supported by the transfer or robot blade between respective locations.
Data Source
AI summary
A cross-shape transfer blade is configured to, in operation, be mounted or coupled to an end of a transfer robot arm (TRA). The cross-shape robot or transfer blade includes a plurality of raised regions to contact a backside of a workpiece or thin workpiece such that the cross-shape transfer blade supports and transports the respective workpeice between various locations within a semiconductor manufacturing plant (FAB). The cross-shape transfer blade includes a first prong structure, a second prong structure, a first wing structure, and a second wing structure. Respective ones of the plurality of raised regions are at corresponding ones of the first prong structure, the second prong structure, the first wing structure, and the second wing structure minimizing contact between the backside of the workpiece or thin workpiece and the cross-shape transfer blade when the workpiece or thin workpiece is being transferred, transported, and supported by the cross-shape transfer blade.