Cross-Stacked Graphene Heat-Conducting Pad With Two-Direction Strength

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Solution Overview

Problem

Traditional thermal interface materials exhibit low thermal conductivity and poor mechanical strength due to the anisotropy and cohesive weakness of graphene films, limiting their application in high heat flux environments.

Innovation Solution

A high-strength graphene heat-conducting pad is prepared by stacking multiple graphene films with their stacking directions perpendicular to each other and adhering them with an adhesive, enhancing mechanical strength and thermal conductivity in both in-plane and through-plane directions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If multiple graphene films are stacked to improve through-plane thermal conductivity, then thermal conductivity in thickness direction is improved, but mechanical strength deteriorates due to poor cohesive strength between layers

Engineering Contradiction:
Improvethrough-plane thermal conductivityVSAvoidmechanical strength
Core Design Contradiction:
TemperatureVSStrength

Solution Approach 1:

The patent creates a composite structure by stacking multiple graphene films with adhesives between them. This composite approach allows the graphene films to provide thermal conductivity while the adhesives compensate for the poor cohesive strength between layers, resolving the contradiction between improved through-plane thermal conductivity and maintained mechanical strength.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The adhesive acts as an intermediary substance between adjacent graphene films. It mediates the interaction between layers, providing both thermal conduction pathways and mechanical bonding to compensate for the inherent weak cohesive strength of stacked graphene films, thus maintaining mechanical strength while enabling improved through-plane thermal conductivity.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Strength

If traditional thermal interface materials are used to ensure mechanical strength, then mechanical strength is maintained, but thermal conductivity deteriorates to 1-10 W/(m·K)

Engineering Contradiction:
Improvemechanical strengthVSAvoidthermal conductivity
Core Design Contradiction:
StrengthVSTemperature

Solution Approach 1:

The patent employs a composite material system combining graphene films and adhesives. The graphene films contribute high thermal conductivity properties while the adhesives provide mechanical strength, achieving a synergistic effect that simultaneously improves thermal conductivity beyond traditional materials while maintaining adequate mechanical strength.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The resulting graphene heat-conducting pad achieves balanced mechanical properties and thermal conductivity, overcoming the limitations of anisotropy and cohesive weakness, making it suitable for high-strength applications.

Implementation Method 1

adjacent graphene heat-conducting layers may be fixedly adhered by means of an adhesive; each of the graphene heat-conducting layers may comprise multiple graphene films stacked in sequence, and adjacent graphene films may be adhered by means of an adhesive

Methodology Applied
Scientific EffectAdhesion: Adhesive

Implementation Method 2

Graphene, a novel carbon material with a single-layer two-dimensional honeycomb lattice structure composed of stacked carbon atoms, not only exhibits excellent mechanical, optical, and electrical properties but also possesses superior thermal properties. Its theoretical thermal conductivity can reach 5300 W/(m·K), which is more than ten times that of common metallic materials.

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP4635733A1High-strength graphene heat-conducting pad and preparation method therefor
Publication Date: 2025.10.22 SHENZHEN HFC SHIELDING PRODS CO LTD
  • EP4635733A1 patent drawingFigure 1
  • EP4635733A1 patent drawingFigure 2~3
  • EP4635733A1 patent drawingFigure 4

AI summary

The present application relates to the field of thermal interface materials. Disclosed are a high-strength graphene heat-conducting pad and a preparation method therefore. The high-strength graphene heat-conducting pad comprises at least two graphene heat-conducting layers stacked in sequence, wherein adjacent graphene heat-conducting layers are fixedly adhered by means of an adhesive; the graphene heat-conducting layers comprise a plurality of layers of graphene films stacked in sequence; adjacent graphene films are adhered by means of an adhesive; and the stacking directions of the graphene films of two adjacent graphene heat-conducting layers are perpendicular to each other and parallel to the same plane, and the stacking directions of the graphene heat-conducting layers are perpendicular to the stacking directions of the graphene films in any graphene heat-conducting layer. In the present application, the graphene heat-conducting layers prepared by stacking the plurality of layers of graphene films are stacked, such that the stacking directions of the graphene films of adjacent layers are perpendicular to each other, thereby providing good mechanical strength in two directions in the graphene heat-conducting pad, namely, a graphene-film stacking direction and a direction perpendicular to the graphene-film stacking direction.