Crossed Thin Metal Wires in Semiconductor Packaging
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Solution Overview
Problem
The semiconductor device faces a short circuit issue due to thin metal wires coming into contact with leads during the resin encapsulation process, caused by the pressure of the injected encapsulating resin.
Innovation Solution
The thin metal wires are arranged to cross each other in a plan view, with the first thin metal wire extending above the second thin metal wire, ensuring that if the first wire is curved by resin pressure, it contacts the second wire instead of a lead, preventing excessive deformation and short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the encapsulating resin is injected at high pressure during resin encapsulation, then the encapsulation process is efficient and complete, but the thin metal wires deform and come into contact with leads causing short circuits
Solution Approach 1:
The patent applies dimensionality change by arranging thin metal wires in a three-dimensional configuration where they extend above other wires, creating vertical separation. This spatial arrangement in multiple dimensions prevents wire-to-lead contact during resin injection while maintaining electrical connectivity, thus resolving the contradiction between encapsulation efficiency and device reliability
2Device complexity
If the thin metal wires are arranged parallel to the resin flow direction, then the wire layout is simple, but the wires experience greater resin pressure and deform more
Solution Approach 1:
The patent transitions from two-dimensional planar wire arrangement to three-dimensional spatial configuration. By extending wires above other wires and creating vertical clearance, the design reduces resin pressure impact on wire positioning while maintaining layout simplicity, thus resolving the contradiction between device complexity and manufacturing precision
Data Source
AI summary
A semiconductor device provided with: an island and an island which are separated from each other; leads which approach the islands at one end; a control element which is attached to the island and is connected to a lead through a thin metal wire; and a switching element which is attached to the island and is connected to the lead through a metal wire. Further, the thin metal wire and the thin metal wire are arranged so as to the intersect.