Crossing-Free Optical Butterfly Switch for Multi-Chip Modules

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Solution Overview

Problem

Existing optical network topologies in silicon photonics suffer from complicated optical-waveguide routing and signal loss due to in-plane optical-waveguide crossings, making them inefficient and energy-intensive for inter-chip communication in multi-chip modules (MCMs).

Innovation Solution

A multi-chip module (MCM) design featuring a crossing-free optical-butterfly switch with optical components in two planes and optical couplers that dynamically allocate communication bandwidth among integrated circuits, eliminating optical-waveguide crossings in a single plane and minimizing signal loss.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a single-plane implementation of optical network is used, then device complexity is reduced, but signal loss increases due to optical-waveguide crossings

Engineering Contradiction:
Improveoptical network structureVSAvoidsignal loss
Core Design Contradiction:
Device complexityVSLoss of energy

Solution Approach 1:

The patent transitions from a single-plane optical network to a three-dimensional stacked architecture with multiple planes (first plane and second plane). Optical waveguides are routed in the first plane while optical switches are placed in the second plane, eliminating in-plane crossings by utilizing the vertical dimension. This dimensional transition resolves the contradiction by maintaining routing simplicity while eliminating signal loss from crossings.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Loss of energy

If optical-waveguide crossings are eliminated, then signal loss is reduced, but device complexity increases due to multi-plane architecture

Engineering Contradiction:
Improvesignal lossVSAvoidoptical network structure
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

By introducing a vertical dimension with stacked planes, the patent separates waveguide routing (first plane) from switching operations (second plane). This spatial separation eliminates the need for complex crossing avoidance techniques while maintaining a relatively simple overall structure through regular, predictable inter-plane coupling.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent introduces optical couplers as intermediary components that facilitate controlled interactions between the first and second planes. These couplers act as mediators that enable necessary optical signal transfer between planes while maintaining the benefits of spatial separation, thus managing the complexity introduced by the multi-plane architecture.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Device complexity

If in-plane optical-waveguide crossings are used, then device complexity is minimized, but crosstalk and signal loss increase

Engineering Contradiction:
Improveoptical waveguide routingVSAvoidcrosstalk
Core Design Contradiction:
Device complexityVSObject-generated harmful factors

Solution Approach 1:

The patent eliminates crosstalk by transitioning from two-dimensional in-plane routing to a three-dimensional stacked architecture. Optical waveguides confined to the first plane and switches in the second plane prevent electromagnetic interference and crosstalk that would occur at crossing points in a single-plane implementation.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables high communication bandwidth, low latency, and low power consumption by eliminating crosstalk and signal loss, providing a suitable balance for interconnect applications in MCMs.

Implementation Method 1

optical waveguides, in a first plane, which convey the modulated optical signals among the integrated circuits

Methodology Applied
Scientific EffectTotal internal reflection: Total Internal Reflection

Implementation Method 2

optical couplers that couple the modulated optical signals to and from the first plane and the second plane

Methodology Applied
Scientific EffectEvanescent field coupling:

Implementation Method 3

integrated circuits that perform electrical-to-optical conversion based on data to provide modulated optical signals

Methodology Applied
Scientific EffectElectrical-to-optical conversion:

Implementation Method 4

receive data in the modulated optical signals by performing optical-to-electrical conversion

Methodology Applied
Scientific EffectOptical-to-electrical conversion:

Data Source

PatentUS9229163B2Butterfly optical network with crossing-free switches
Publication Date: 2016.01.05 ORACLE INT CORP
  • US9229163B2 patent drawing
  • US9229163B2 patent drawing
  • US9229163B2 patent drawing

AI summary

In a multi-chip module (MCM), optical waveguides in a first plane convey modulated optical signals among integrated circuits (which are sometimes referred to as ‘chips’). Moreover, an optical-butterfly switch, optically coupled to the optical waveguides, dynamically allocates communication bandwidth among the integrated circuits. This optical-butterfly switch includes optical components in the first plane and a second plane, and optical couplers that couple the modulated optical signals to and from the first plane and the second plane. In this way, the MCM communicates the modulated optical signals among the integrated circuits without optical-waveguide crossings in a given plane.