Crossing Structures for Integrated Transformers and Inductors
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Solution Overview
Problem
Integrated transformers and inductors in RF circuits occupy large areas, necessitating a reduction in size without compromising coupling coefficient (K) or quality factor (Q).
Innovation Solution
The proposed crossing structures for integrated transformers and inductors utilize multiple segments on different metal layers connected by through structures to form traces, allowing for flexible design and optimization of coupling coefficient and quality factor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If conventional integrated transformer and inductor structures are used, then coupling coefficient and quality factor are maintained, but area occupancy is large
Solution Approach 1:
The patent utilizes multiple metal layers (first metal layer and second metal layer) to create three-dimensional winding structures. Traces are routed on different layers and connected through via structures, transforming a two-dimensional planar layout into a three-dimensional configuration. This dimensional transition enables compact area occupancy while preserving the magnetic coupling and electrical performance required for adequate coupling coefficient and quality factor.
Solution Approach 2:
The patent implements nested winding structures where traces on different metal layers are interlaced and connected through via structures. The first and second traces are arranged in a nested configuration, with each trace passing through or near the other in the vertical dimension. This nesting approach maximizes the use of available space while maintaining the necessary magnetic flux linkage for adequate coupling coefficient.
2Area of stationary object
If area of integrated transformer and inductor is reduced, then area occupancy decreases, but coupling coefficient and quality factor may degrade
Solution Approach 1:
By transitioning to three-dimensional multi-layer routing, the patent achieves compact area occupancy without compromising performance. The vertical stacking of traces on different metal layers connected by vias allows precise control of trace spacing and coupling, maintaining manufacturing precision for coupling coefficient and quality factor while reducing the planar footprint.
Solution Approach 2:
The patent employs via structures with controlled dimensions and positioning to maintain precise electrical and magnetic coupling between traces on different layers. By carefully controlling via diameter, spacing, and alignment, the design preserves the coupling coefficient and quality factor despite the reduced area, effectively using parameter optimization to bridge the gap between compact size and performance.
3Area of stationary object
If multi-layer crossing structures are implemented, then area occupancy is reduced and design flexibility is improved, but device complexity increases
Solution Approach 1:
The patent uses standard multi-layer PCB/metallization techniques with via structures to create compact three-dimensional trace routing. This approach leverages existing manufacturing capabilities rather than introducing complex new processes, achieving area reduction through vertical stacking while keeping device complexity within acceptable bounds for integrated transformer and inductor fabrication.
Data Source
AI summary
The invention discloses crossing structures of an integrated transformer or an integrated inductor. The crossing structures can be applied to various integrated transformers or integrated inductors. The crossing structures disclosed in the present invention includes multiple segments fabricated on a first metal layer of the semiconductor structure and multiple segments fabricated on a second metal layer of the semiconductor structure, the first metal layer being different from the second metal layer.