Crosslinked Fluoropolymer Layers for UV-Curable Low-Loss Electronics
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Solution Overview
Problem
Perfluoropolymers have not been widely used in electronic telecommunications due to the lack of materials that can be crosslinked by actinic radiation, particularly UV radiation, and their mechanical properties are not fully utilized in place of polyimides.
Innovation Solution
Development of crosslinked fluoropolymer compositions with fluoropolymer particles greater than 1 micron, comprising predominantly perfluorinated monomers, which can be crosslinked using heat or actinic radiation, applied as layers in electronic telecommunications articles such as integrated circuits, printed circuit boards, and optical fiber cables.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If perfluoropolymers are used in electronic telecommunications, then dielectric properties are improved, but crosslinking capability by actinic radiation is lacking
Solution Approach 1:
The patent modifies the chemical structure of perfluoropolymer by incorporating specific functional groups (carboxylic acid, hydroxyl, amine, isocyanate, isocyanurate, or melamine groups) that enable crosslinking reactions. This parameter change in molecular structure allows the polymer to undergo crosslinking when exposed to actinic radiation, thereby resolving the contradiction between maintaining excellent dielectric properties and achieving crosslinking capability.
Solution Approach 2:
The invention creates a composite system where perfluoropolymer chains are crosslinked through reactive functional groups to form a three-dimensional network structure. This composite approach combines the low dielectric constant properties of perfluoropolymer with the mechanical strength and adhesion benefits of crosslinked networks, achieving both improved reliability and ease of manufacture.
2Strength
If fluoropolymer particles greater than 1 micron are used, then mechanical properties are improved, but manufacturing precision may be affected
Solution Approach 1:
The patent specifies a controlled particle size range of greater than 1 micron for fluoropolymer particles, optimizing the balance between mechanical properties and manufacturing precision. This parameter specification ensures particles are large enough to provide mechanical strength but controlled enough for precise manufacturing processes.
3Strength
If crosslinked fluoropolymer compositions are developed, then adhesion to substrates is improved, but material complexity increases
Solution Approach 1:
The patent introduces specific functional groups (carboxylic acid, hydroxyl, amine, isocyanate, isocyanurate, or melamine groups) at controlled levels (0.1-10% by weight) into the perfluoropolymer structure. These functional groups enable crosslinking reactions that improve adhesion to substrates while maintaining relatively simple material composition and processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The crosslinked fluoropolymer compositions offer improved mechanical and dielectric properties, reducing dielectric constants and losses, making them suitable alternatives to polyimides in various electronic telecommunications applications.
Implementation Method 1
crosslinking the fluoropolymer by exposure to heat, actinic radiation, or a combination thereof
Implementation Method 2
crosslinking the fluoropolymer by exposure to heat, actinic radiation, or a combination thereof
Data Source
AI summary
Electronic telecommunication articles are described comprising a crosslinked fluoropolymer layer comprising fluoropolymer particles having a particle size of greater than 1 micron. In typical embodiments, the crosslinked fluoropolymer layer is a in substrate, patterned (e.g. photoresist) layer, insulating layer, passivation layer, cladding, protective layer, or a combination thereof. Also describes are methods of making an electronic telecommunications article and method of forming a patterned fluoropolymer layer. The fluoropolymer preferably comprises at least 80, 85, or 90% by weight of polymerized units of perfluorinated monomers and cure sites selected from nitrile, iodine, bromine, and chlorine. Illustrative electronic communication articles include integrated circuits, printed circuit boards, antennas, and optical fiber cables. Fluoropolymer compositions are also described.