Crosslinked Hollow Particles for Low Ion Migration Encapsulants
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Solution Overview
Problem
Hollow particles used to reduce dielectric dissipation factor and improve performance stability in high-humidity environments are prone to ion migration due to the presence of metal and surfactants that can be easily eluted, leading to potential failures in electronic circuit boards.
Innovation Solution
Development of hollow particles with a resin shell and a high void ratio, containing a crosslinkable monomer unit of 60% by mass, and having a pH of 6.5 to 7.5 and conductivity of 50 μS/cm or less in an aqueous dispersion, produced through suspension polymerization without surfactants, to minimize metal and surfactant content on the surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If hollow particles are produced using conventional methods with surfactants and metal catalysts, then the production process is easier and more established, but the dielectric dissipation factor increases and performance stability in high-humidity environments deteriorates due to ion migration
Solution Approach 1:
The invention extracts and removes harmful components (surfactants and metal catalysts) from the hollow particle production process. By using a surfactant-free emulsion polymerization method with organic peroxide as initiator and conducting thorough washing steps, the patent eliminates substances that cause ion migration, thereby improving reliability in high-humidity environments while maintaining manufacturability through established polymerization techniques
Solution Approach 2:
The invention changes critical production parameters: using organic peroxide instead of metal catalysts, operating at specific temperature ranges (50-80°C), and controlling pH levels during washing. These parameter changes eliminate harmful metal ions and surfactants while maintaining efficient polymerization and particle formation, resolving the contradiction between reliability and ease of manufacture
2Object-generated harmful factors
If hollow particles contain metal ions and surfactants to facilitate production, then the manufacturing process is simpler, but the dielectric dissipation factor increases and ion migration occurs in high-humidity environments
Solution Approach 1:
The invention converts the potentially harmful role of surfactants and metal catalysts into beneficial functions. Instead of using metal catalysts that cause ion migration, organic peroxide is used as a benign initiator. Surfactants are replaced by careful pH control and washing procedures. This converts the harmful presence of these substances into a beneficial elimination process, reducing dielectric dissipation factor while maintaining production simplicity through well-established polymerization methods
3Strength
If hollow particles are produced with crosslinking monomers and surfactants, then the shell strength is improved, but the dielectric dissipation factor increases and performance in high-humidity environments deteriorates
Solution Approach 1:
The invention extracts harmful surfactants and metal catalysts from the crosslinking process while maintaining shell strength. By using organic peroxide initiators and conducting thorough washing, the patent achieves strong crosslinked shells without the dielectric penalties of conventional methods. The crosslinking structure provides mechanical strength while the absence of harmful additives maintains low dielectric dissipation factor
Solution Approach 2:
The invention creates a composite shell structure through crosslinking of vinyl monomers with specific functional groups. The crosslinked polymer network provides enhanced strength and structural integrity, while the organic-based crosslinking system avoids metal catalysts. This composite approach combines the benefits of strong shells with the electrical performance requirements, eliminating the trade-off between strength and dielectric properties
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces dielectric dissipation factor and enhances performance stability in high-humidity environments by minimizing the elution of metal and surfactants, thereby preventing ion migration and ensuring reliable operation of electronic circuit boards.
Implementation Method 1
hollow particles... for the purpose of weight reduction, heat insulation, a decrease in permittivity
Implementation Method 2
subjecting the obtained dispersion to suspension polymerization
Implementation Method 3
dispersing an organic mixed solution in an aqueous solution containing a surfactant
Implementation Method 4
the shell contains a polymer as the resin, and a content of a crosslinkable monomer unit is 60% by mass or more
Data Source
AI summary
To provide hollow particles in which the dielectric dissipation factor is decreased, and the performance stability in high-humidity environment is improved. Hollow particles comprising a shell, which contains a resin, and a hollow portion surrounded by the shell, wherein the hollow particles have a void ratio of 50% or more; wherein the shell contains a polymer as the resin, and a content of a crosslinkable monomer unit is 60% by mass or more in 100% by mass of all monomer units of the polymer; and wherein an aqueous dispersion of the hollow particles, which is obtained by dispersing the hollow particles with a volume of 0.35 cm3 in 100 mL of deionized water, has a pH of 6.5 or more and 7.5 or less and a conductivity of 50 μS/cm or less.