Crosslinked Polysilazane Composition for Thick, Crack-Resistant Films
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Solution Overview
Problem
Existing polysilazane-based films face challenges in achieving thicker film thickness and require high conversion temperatures, with insufficient crack resistance in thick films.
Innovation Solution
A crosslinked polysilazane composition is developed, comprising specific repeating units and crosslinking agents, formed through heating or light irradiation with a reaction initiator, to enhance film thickness and crack resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If a general polysilazane is used singly to form a silicon-containing film, then the film can be formed with a simple process, but the film thickness cannot be increased and crack resistance is insufficient in thick films
Solution Approach 1:
The patent applies composite materials by combining polysilazane with crosslinking agents (such as silane compounds or isocyanate compounds) to create a crosslinked polysilazane composition. This composite approach enables the formation of thick silicon-containing films with improved crack resistance, as the crosslinked structure provides mechanical strength while maintaining film integrity at increased thicknesses.
Solution Approach 2:
The patent employs parameter changes by modifying the chemical structure of polysilazane through crosslinking. The crosslinking reaction changes the molecular parameters of the polysilazane, creating a three-dimensional network structure that simultaneously enables increased film thickness and improved crack resistance, resolving the contradiction between film thickness and reliability.
2Temperature
If a general polysilazane is used to form a silicon-containing film, then the conversion process is relatively simple, but a high temperature is required for conversion to a siliceous substance
Solution Approach 1:
The patent applies parameter changes by introducing crosslinking agents that modify the thermal conversion behavior of polysilazane. The crosslinked structure alters the decomposition and conversion parameters, enabling the formation of siliceous substances at lower temperatures compared to unmodified polysilazane, thus reducing the conversion temperature while maintaining process simplicity.
3Length of stationary object
If the film thickness is increased to meet device requirements, then the film can provide sufficient insulation, but crack resistance deteriorates in thick films
Solution Approach 1:
The patent resolves this contradiction by creating a composite material system where polysilazane is crosslinked with specific agents. The crosslinked network structure provides enhanced mechanical strength and crack resistance even at increased film thicknesses, allowing the film to simultaneously achieve sufficient insulation thickness and maintain structural integrity.
Solution Approach 2:
The patent applies the principle of curvature by introducing crosslinking bonds that create a three-dimensional network structure within the film. This spatial network configuration distributes stress more effectively throughout the thick film, preventing crack propagation and maintaining strength despite increased thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The crosslinked polysilazane enables the formation of thicker silicon-containing films with improved crack resistance, suitable for electronic device applications.
Implementation Method 1
A polysilazane has the property of being converted into a siliceous substance by heating
Implementation Method 2
heating or irradiating with light, in the presence of a reaction initiator, a polysilazane comprising a repeating unit represented by the formula (2) and at least two Si—H bonds
Data Source
AI summary
A crosslinked polysilazane includes a repeating unit represented by the formula (1) as defined herein: