Cross-linked Thermoplastic Dielectric for Chip Package Moisture Resistance
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing chip packages face challenges in achieving reliable electrical, mechanical, and thermal stability, particularly due to high moisture absorption and limited insulation strength of conventional encapsulants like epoxy resin, which can lead to electronic misoperation and reduced reliability.
Innovation Solution
A chip package utilizing a highly filled cross-linked thermoplastic material as a dielectric structure, which is optically opaque and thermally stable, combining the benefits of thermoplastic and thermosetting materials through cross-linking and the addition of filler particles to enhance mechanical, thermal, and electrical properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional epoxy resin is used as encapsulant, then the package can be manufactured with good processability and mechanical stability, but the electrical reliability and dielectric strength are limited due to high moisture absorption
Solution Approach 1:
The patent employs a composite material system consisting of thermoplastic polymer matrix combined with cross-linking agents and multiple types of filler particles (such as silica, alumina, and other inorganic fillers). This composite structure reduces moisture absorption by creating a more hydrophobic and densely packed material matrix, thereby improving electrical reliability and dielectric strength while maintaining mechanical stability.
Solution Approach 2:
The patent modifies the chemical and physical parameters of the encapsulant material by introducing cross-linking mechanisms that alter the polymer structure. The cross-linking degree and network density are controlled to optimize moisture resistance and dielectric properties. Additionally, the filler particle size distribution, shape, and surface treatment parameters are adjusted to enhance the overall performance of the encapsulant.
2Reliability
If highly filled thermoplastic material is used to reduce moisture absorption, then electrical reliability improves, but mechanical stability and thermal stability may be compromised without cross-linking
Solution Approach 1:
The patent applies cross-linking treatments to the thermoplastic material to fundamentally change its molecular structure from linear chains to a three-dimensional network. This parameter change in molecular architecture provides both mechanical stability and thermal stability while maintaining the low moisture absorption characteristics of the highly filled thermoplastic composition.
Solution Approach 2:
The patent creates a composite material system where cross-linking agents are incorporated into the thermoplastic matrix along with filler particles. This composite approach ensures that the material achieves both mechanical strength through cross-linking and moisture resistance through the filled structure, resolving the contradiction between electrical reliability and mechanical stability.
3Stability of the object's composition
If cross-linking is applied to thermoplastic material to improve mechanical and thermal stability, then the material gains thermosetting properties, but processing flexibility may be reduced
Solution Approach 1:
The patent incorporates cross-linking agents and initiators into the thermoplastic material during the compounding stage, but the actual cross-linking reaction is triggered only after molding or during a subsequent heat treatment step. This preliminary preparation allows the material to be processed as a conventional thermoplastic (with full flexibility) and then transformed into a cross-linked structure afterward, thus resolving the contradiction between processing ease and thermal stability.
Solution Approach 2:
The patent utilizes phase transition mechanisms where the material exists in a processable thermoplastic phase during manufacturing, then transitions to a cross-linked thermoset phase through controlled heating or chemical activation. This phase transition approach allows the material to exhibit different properties at different stages: ease of processing in the initial phase and thermal/mechanical stability in the final phase.
4Reliability
If the dielectric structure is made optically opaque to prevent radiation-induced misoperation, then electrical reliability improves, but visibility for inspection and monitoring is reduced
Solution Approach 1:
The patent incorporates opaque filler particles (such as carbon black, titanium dioxide, or other pigmented fillers) into the thermoplastic matrix to create an optically opaque dielectric structure. This composite material approach blocks radiation that could cause electronic misoperation while maintaining the electrical reliability benefits. The filler particles are distributed throughout the material to ensure complete opacity without compromising the dielectric properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves the electrical reliability, mechanical stability, and thermal performance of the package by reducing moisture absorption and increasing dielectric strength, while preventing radiation-induced misoperation and efficiently dissipating heat, thus enhancing the overall performance and longevity of the chip package.
Implementation Method 1
cross-linking a highly filled thermoplastic material
Implementation Method 2
efficiently dissipating heat
Data Source
AI summary
A package and method of manufacturing a package is disclosed. In one example, the package includes an electronic chip and a dielectric structure comprising a highly filled cross-linked thermoplastic material.