Crosslinked Vinylaromatic Resin Composition for Low-Loss PCB Bonding
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Solution Overview
Problem
Existing resin compositions used in printed circuit boards exhibit insufficient dielectric characteristics and bonding performance, particularly at high frequencies, and are limited by high dielectric constants and loss tangents, which hinder signal transmission and processing speed in electronic devices.
Innovation Solution
A resin composition containing a functional group-modified vinylaromatic copolymer with a high crosslinking degree, combined with a curable reactive resin and/or a thermoplastic resin, to achieve a balanced dielectric performance and bonding strength, using specific molecular weights and functional group modifications to enhance solubility and processability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If phenol resins or epoxy resins are used for printed circuit boards, then heat resistance and dimensional stability are improved, but dielectric constant and loss tangent increase at high frequencies
Solution Approach 1:
The invention uses a composite resin system combining cyanate ester resin (for low dielectric loss) with phenol resin or epoxy resin (for heat resistance and bonding). This composite approach allows the material to simultaneously achieve low dielectric constant and loss tangent at high frequencies while maintaining excellent heat resistance and dimensional stability required for printed circuit board applications.
2Loss of energy
If cyanate ester resins are used to improve dielectric characteristics, then heat resistance and dielectric properties are improved, but solubility decreases and large amounts of solvents are required
Solution Approach 1:
The invention merges cyanate ester resin with phenol resin or epoxy resin in a composite system. This combination allows the cyanate ester to provide low dielectric loss while the phenol or epoxy resin component enhances solubility and reduces the need for large amounts of solvents, making the resin composition easier to manufacture and process.
3Temperature
If bismaleimide resins are used for high temperature retention, then physical properties at high temperature are improved, but dielectric characteristics become insufficient and brittleness increases
Solution Approach 1:
The invention creates a composite resin system where bismaleimide resin is combined with cyanate ester resin and phenol or epoxy resin. This composite structure allows the bismaleimide to provide high temperature retention of physical properties while the cyanate ester component maintains low dielectric loss, and the phenol/epoxy resin reduces brittleness and improves overall dielectric characteristics.
4Loss of energy
If polyphenylene ether resin with vinylbenzyl groups is used, then heat resistance and dielectric characteristics are balanced, but bonding performance deteriorates
Solution Approach 1:
The invention combines polyphenylene ether resin with cyanate ester resin, phenol resin, and/or epoxy resin in a composite system. This composite approach allows the polyphenylene ether to provide balanced heat resistance and dielectric characteristics while the cyanate ester, phenol, and epoxy resin components enhance bonding performance through their reactive functional groups and adhesion properties.
Data Source
AI summary
To provide a resin composition which exhibits excellent dielectric characteristics and bonding after being cured and which can be used as a dielectric material, an insulating material, and an adhesive material in the fields of electrical and electronic industries, spacecraft and aircraft industries. A resin composition containing: (A) a functional group-modified vinylaromatic copolymer containing a structural unit (a) derived from a divinylaromatic compound and a structural unit (b) derived from a monovinylaromatic compound, wherein 95% by mol or more of the structural unit (a) is a crosslinked structural unit (a1) represented by the following formula (1):wherein R1 represents an aromatic hydrocarbon group having 6 to 30 carbon atoms; the functional group-modified vinylaromatic copolymer is modified by at least one functional group selected from the group consisting of an amino group, an alkoxysilyl group, and a hydroxyl group; and (B) a curable reactive resin and/or (C) a thermoplastic resin.