Crown Ether Encapsulant Preventing Lead Leakage in Perovskite Devices
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Solution Overview
Problem
Existing encapsulants for perovskite materials face challenges in preventing lead leakage due to poor solubility and limited ability to block moisture and oxygen, making it difficult to form a stable encapsulant in a solution process.
Innovation Solution
A crown ether-based compound with alkyl groups, such as tert-butyl, is used to improve solubility and form a stable encapsulant. Additionally, incorporating titanium oxide enhances the encapsulant's ability to block external moisture and oxygen, allowing for a mass ratio of crown ether-based compound to titanium oxide ranging from 1:1 to 1:10.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If crown ether is used as encapsulant to prevent lead leakage via chelate bond, then lead leakage prevention ability is improved, but solubility is poor making it difficult to form in solution process
Solution Approach 1:
The patent combines crown ether with metal oxide particles to create a composite encapsulant material. This composite structure allows the crown ether to maintain its lead-chelating function while the metal oxide component provides solubility enhancement and moisture/oxygen blocking capabilities, resolving the contradiction between lead leakage prevention and manufacturability
Solution Approach 2:
The patent modifies the physical and chemical parameters of the encapsulant system by incorporating metal oxide particles with specific surface areas and crystal structures. This parameter change enables the crown ether to be processed in solution while maintaining its encapsulation effectiveness, bridging the gap between performance and ease of manufacture
2Object-affected harmful factors
If metal oxide is added to block external moisture and oxygen, then moisture and oxygen blocking ability is improved, but solubility remains poor
Solution Approach 1:
The patent utilizes metal oxide particles with controlled porosity and surface area to create an effective barrier against moisture and oxygen. The porous structure provides high surface area for blocking harmful substances while the particle morphology enables good dispersion in solution, achieving both protection and manufacturability
3Reliability
If encapsulant is formed to prevent lead leakage, then device stability is improved, but solution process formation is difficult due to poor solubility
Solution Approach 1:
The metal oxide particles act as an intermediary that facilitates the formation of the crown ether encapsulant in solution. The metal oxide surface provides nucleation sites and the composite structure enables solution processing, allowing the encapsulant to be formed stably while maintaining device protection functionality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed encapsulant effectively prevents lead leakage, maintains thermal stability, and facilitates a straightforward solution process, achieving improved encapsulating ability and mechanical stability.
Implementation Method 1
leakage of the lead is prevented via a chelate bond thereof to a lead element
Implementation Method 2
the encapsulant blocks external moisture and oxygen, thus contributing to device stability
Data Source
AI summary
An encapsulant for encapsulating perovskite to prevent lead leakage therefrom, a method for encapsulating perovskite to prevent lead leakage therefrom, and a perovskite photoactive device including the encapsulant are disclosed. The encapsulant for encapsulating perovskite may contain a crown ether-based compound having a benzene ring substituted with an alkyl group. The perovskite encapsulating method may include coating, on a perovskite layer, a solution in which a crown ether-based compound having a benzene ring substituted with an alkyl group is dissolved in an organic solvent. The perovskite photoactive device includes an encapsulant encapsulating the perovskite layer to prevent the lead leakage therefrom.


