Cryogenic Chip Substrate With Through-Vias for Cooling and Signal Density
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Solution Overview
Problem
Existing electronic die supports for cryogenic environments are often expensive, bulky, and have a limited number of contacting elements, which restricts efficient cooling and signal transmission in cryogenic systems.
Innovation Solution
A support system comprising a printed circuit board with conductive regions for the die and thermal connectors, connected by thermally conductive vias, and additional conductive regions to enhance thermal conduction and convection, allowing for improved mechanical holding and cooling of electronic dies in cryogenic environments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional supports are used for cryogenic electronic dies, then mechanical holding is achieved, but thermal management efficiency is poor and the structure is bulky
Solution Approach 1:
The patent transitions from traditional lateral thermal conduction paths to vertical thermal conduction through through-vias. The thermal conduction path extends through the thickness dimension of the substrate, allowing heat to be conducted directly from the die contact region through the substrate thickness to the opposite surface, significantly reducing thermal resistance and improving thermal management efficiency while maintaining a compact form factor
Solution Approach 2:
The patent introduces through-vias as intermediary thermal conduction elements that bridge the die contact region and the opposite substrate surface. These vias act as thermal mediators, providing a direct thermal pathway through the substrate and enabling efficient heat transfer from the die to the cooling structure without requiring bulky traditional heat sinks
2Productivity
If traditional supports with limited contacting elements are used, then mechanical simplicity is maintained, but signal transmission capabilities are restricted
Solution Approach 1:
The through-vias serve multiple functions simultaneously: they provide mechanical support for the die, establish electrical signal transmission pathways, and conduct heat away from the die. This multi-functionality increases signal transmission capabilities without proportionally increasing structural complexity, as the same vertical elements handle multiple tasks
Solution Approach 2:
The patent moves contacting elements from lateral arrangements on the substrate surface to vertical arrangements through the substrate thickness. This dimensional change allows multiple signal pathways to be stacked vertically, increasing signal transmission capacity without expanding the lateral footprint of the support structure
3Reliability
If traditional expensive supports are used, then reliable thermal conduction is achieved, but cost effectiveness is poor
Solution Approach 1:
The patent changes the thermal conduction mechanism from relying on large lateral thermal mass to utilizing vertical thermal conduction through controlled vias. By changing the geometry and arrangement of thermal pathways from extensive lateral structures to focused vertical pathways, reliable thermal conduction is achieved with less material and lower manufacturing cost
Solution Approach 2:
The patent segments the thermal conduction function into discrete through-vias distributed across the substrate. Instead of using a single bulky thermal management structure, multiple smaller via elements are distributed to provide redundant and reliable thermal conduction pathways, improving reliability while reducing overall material usage and cost
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient thermal management and increased signal transmission capabilities by reducing thermal resistance and allowing for a higher number of contacting elements, resulting in improved performance and compactness of the support system.
Implementation Method 1
the first region being connected to the second region by at least one through conductive via, located vertically in line with the first region
Implementation Method 2
the via is filled with a thermally conductive material
Implementation Method 3
the via is hollow and has lateral walls coated with a thermally-conductive material
Implementation Method 4
the via is hollow and has lateral walls coated with a thermally-conductive material
Data Source
AI summary
The present description concerns a support (108) for an electronic die (110), comprising: a first printed circuit board (300); a first conductive region (310), intended to receive the die, located on a first surface (108i) of the first board; and a second conductive region (320), intended to receive a thermal connector (200), located on a second surface (108s) of the first board, opposite to the first surface, the first region being connected to the second region by at least one through conductive via (330), located vertically in line with the first region.