Substrate Support Electrical Connector for Cryogenic Vacuum Isolation

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Solution Overview

Problem

Operating a substrate support assembly at cryogenic temperatures poses challenges such as fluid and vacuum leaks due to expansion and contraction, and arcing issues, which hinder reliable electrical connections and processing in semiconductor manufacturing.

Innovation Solution

An electrical connector design featuring a first and second interface body with recesses and bus bars, ensuring vacuum maintenance and electrical conductivity while preventing arcing, by using dielectric materials and adhesives to create void-free spaces and isolate electrical pathways.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If electrical connections are provided within the substrate support assembly, then electrical conductivity is achieved, but arcing occurs leading to reliability issues

Engineering Contradiction:
Improveelectrical connection reliabilityVSAvoidarcing
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent introduces dielectric materials as intermediary substances between electrical terminals and conductive paths. These dielectric barriers prevent direct electrical breakdown and arcing between adjacent terminals, while still allowing controlled electrical connections where needed. The dielectric material acts as a mediator that enables reliable electrical connectivity without the harmful arcing effect.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Productivity

If the substrate support assembly operates at cryogenic temperatures, then processing capability is improved, but expansion and contraction cause fluid and vacuum leaks

Engineering Contradiction:
Improveprocessing capabilityVSAvoidvacuum integrity
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent explicitly addresses thermal expansion and contraction effects by designing the substrate support assembly to accommodate dimensional changes at cryogenic temperatures. The structure incorporates features that allow controlled expansion and contraction without compromising vacuum seals or fluid pathways, thereby maintaining vacuum integrity while enabling cryogenic processing operations.

Inventive Principle:
Principle #37Thermal expansion

3Temperature

If thermal energy transfer is reduced, then temperature control is improved, but electrical connection stability becomes challenging

Engineering Contradiction:
Improvetemperature controlVSAvoidelectrical connection stability
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The patent segments the electrical connection structure into distinct thermal zones. Electrical terminals and connection points are positioned and designed to minimize thermal gradients, while dielectric materials provide thermal isolation where needed. This segmentation allows different parts of the electrical connection system to operate at optimized temperatures, maintaining connection stability while achieving overall temperature control.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables reliable electrical connections and vacuum maintenance across a wide temperature range, reducing thermal energy transfer and arcing risks, thereby enhancing semiconductor processing efficiency and production life.

Implementation Method 1

The adhesive is disposed between the first vertical face and the outer face such that a space between the first vertical face and the outer face is void free

Methodology Applied
Scientific EffectAdhesive bonding: Adhesive

Implementation Method 2

by using dielectric materials and adhesives to create void-free spaces and isolate electrical pathways

Methodology Applied
Scientific EffectDielectric insulation: Dielectric

Data Source

PatentUS20240235097A1Electrical connector for a substrate support assembly
Publication Date: 2024.07.11 APPLIED MATERIALS INC
  • US20240235097A1 patent drawing
  • US20240235097A1 patent drawing
  • US20240235097A1 patent drawing

AI summary

An electrical connector for a substrate support assembly is disclosed herein. The electrical connector includes a first interface body, a second interface body coupled to the first interface body, and a recess within the second interface body. Each of the first interface body and the second interface body comprise a plurality of electrical terminals disposed in sockets formed within the respective first and second interface bodies. Some electrical terminals disposed in sockets of the first interface body are coupled to respective electrical terminals disposed in sockets of the second interface body and form a plurality of isolated electrical pathways. The second interface body includes a bus bar disposed in the recess, connecting at least two of the plurality of first electrical terminals to at least a one of the plurality of second electrical terminals.