Cryogenic cooling system

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Solution Overview

Problem

Cryogenic cooling systems face challenges in efficient installation and thermalization due to manufacturing tolerances, leading to misaligned joints and reduced thermal performance, which complicates the setup and operation of complex low-temperature experiments like Quantum Information Processing.

Innovation Solution

A cryogenic cooling system with a self-supporting demountable insert comprising primary and secondary plates connected by adjustment members that ensure conductive thermal contact, allowing for easy alignment and adjustment to accommodate misalignments, thereby simplifying the installation and maintenance process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If modular upgrades are provided to accommodate growing experimental services, then the system can accommodate increasing complexity, but manufacturing tolerances accumulate to result in mismatched joints and poorly thermalised platforms

Engineering Contradiction:
Improveaccommodation of experimental servicesVSAvoidjoint alignment
Core Design Contradiction:
Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The system is divided into a primary insert and a demountable secondary insert, each comprising multiple plates that can be independently manufactured and assembled. This segmentation allows modular upgrades while maintaining manufacturing precision through separate assembly processes.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Adjustment members are incorporated to dynamically compensate for misalignments between plates. These adjustment members allow for real-time correction of positioning errors, ensuring effective thermal communication despite accumulated manufacturing tolerances across multiple modular components.

Inventive Principle:
Principle #15Dynamics

2Reliability

If extensive adjustments are made to achieve proper thermalisation, then thermal performance is improved, but installation time and complexity increase significantly

Engineering Contradiction:
ImprovethermalisationVSAvoidadjustment process
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The adjustment members are pre-configured within the plate structures to automatically compensate for misalignments when plates are brought together. This preliminary arrangement eliminates the need for extensive post-assembly adjustments, achieving reliable thermalisation through the inherent design of the adjustment mechanism.

Inventive Principle:
Principle #10Preliminary action

3Adaptability or versatility

If customised installation of experimental apparatus is performed, then specific experimental requirements are met, but installation becomes difficult and time-consuming requiring cranes or elevated platforms

Engineering Contradiction:
Improveexperimental configurationVSAvoidinstallation process
Core Design Contradiction:
Adaptability or versatilityVSEase of operation

Solution Approach 1:

The secondary insert is designed as a demountable module that can be pre-assembled with experimental apparatus outside the cryogenic system. This segmentation allows customisation of experimental configurations while simplifying installation, as the complete module can be installed as a single unit without requiring complex in-situ assembly operations.

Inventive Principle:
Principle #1Segmentation

4Reliability

If testing is performed after installation to ensure satisfactory function, then system reliability is verified, but significant time is consumed reducing experimental data collection time

Engineering Contradiction:
Improvesystem functionVSAvoiddata collection time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The modular design with pre-configured adjustment members allows the secondary insert to be tested and verified for proper thermalisation before installation into the cryogenic system. This preliminary verification ensures reliable system function while minimizing post-installation testing time, thereby maximizing experimental data collection time.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system achieves effective thermal communication between components, reducing the need for extensive adjustments and enabling faster setup and operation of low-temperature experiments by ensuring efficient thermalization and minimizing experimental downtime.

Implementation Method 1

the adjustment members cause the primary and secondary contact surfaces of the respective primary and secondary plates to be brought into conductive thermal contact

Methodology Applied
Scientific EffectConductive thermal contact: Conduction (thermal)

Data Source

PatentEP4246064B1Cryogenic cooling system
Publication Date: 2024.10.30 OXFORD NANOSCIENCE LTD
  • EP4246064B1 patent drawingFigure 1
  • EP4246064B1 patent drawingFigure 2
  • EP4246064B1 patent drawingFigure 3

AI summary

A cryogenic cooling system is provided comprising a primary insert 118 and a demountable secondary insert 128. The primary insert 118 comprises a plurality of primary plates 111, 112, each primary plate having a primary contact surface, and one or more primary connecting members 117 arranged so as to connect the plurality of primary plates 111, 112. The demountable secondary insert 128 comprises a plurality of secondary plates 121, 122, each secondary plate having a secondary contact surface, and one or more secondary connecting members 127 arranged so as to connect the plurality of secondary plates 121, 122 such that the secondary insert 128 is self-supporting. Cooling apparatus is attached to the secondary insert. One or more adjustment members are configured such that, when the secondary insert 128 is mounted to the primary insert 118, the adjustment members cause the primary and secondary contact surfaces of the respective primary 111, 112 and secondary plates 121, 122 to be brought into conductive thermal contact.