Cryogenic Cooling System for High Average Power Laser Oscillators

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Solution Overview

Problem

Cryogenically-cooled laser amplifiers face limitations due to thermal effects such as film boiling, which reduces heat transfer efficiency and causes material deformations, limiting the average power of high-energy laser systems.

Innovation Solution

A cryogenic cooling system that directly contacts the laser amplifier material with a flowing cryogenically-cooled liquid, such as liquid oxygen, below its boiling point, using a heat exchanger and pump to maintain efficient heat transfer without film boiling, and a vacuum chamber to prevent condensation and ensure optimal cooling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If direct contact with boiling liquid nitrogen is used for cryogenic cooling, then cooling efficiency is improved, but film boiling occurs which reduces heat transfer efficiency and limits average power

Engineering Contradiction:
Improvecooling efficiencyVSAvoidheat transfer efficiency
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The invention changes the temperature parameter of the cryogenic liquid from boiling point to sub-cooled temperature (below boiling point). This parameter change prevents film boiling while maintaining high heat transfer efficiency, thereby resolving the contradiction between cooling efficiency and heat transfer reliability

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The invention applies preliminary cooling to the cryogenic liquid before it contacts the laser material, preventing the formation of vapor film in advance. By pre-cooling the liquid below its boiling point, the system anticipates and prevents film boiling, maintaining reliable heat transfer at high power levels

Inventive Principle:
Principle #9Preliminary anti-action

2Power

If soldering or thermal contact with copper heat sink is used, then heat removal is improved, but thermal expansion mismatch causes material deformations

Engineering Contradiction:
Improveheat removal capacityVSAvoidmaterial deformation
Core Design Contradiction:
PowerVSManufacturing precision

Solution Approach 1:

The invention extracts the laser material from direct thermal contact with solid heat sinks (copper blocks). By removing the solid- solid thermal contact interface, the invention eliminates the thermal expansion mismatch problem that causes deformations, while maintaining effective heat removal through liquid cooling

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The invention introduces a liquid cryogenic coolant as an intermediary between the heat source and the cooling system. This liquid mediator provides thermal contact without the rigid thermal expansion constraints of solid-to-solid contact, preventing deformation while enabling heat removal

Inventive Principle:
Principle #24Intermediary (Mediator)

3Temperature

If materials are placed between laser material and cooling source, then thermal contact is improved, but temperature increases due to conduction within the heat sink

Engineering Contradiction:
Improvethermal contactVSAvoidtemperature increase
Core Design Contradiction:
TemperatureVSPower

Solution Approach 1:

The invention extracts and eliminates intermediate materials between the laser material and cooling source. By using direct liquid-to-material contact without solid intermediaries, the system removes the thermal resistance and heat accumulation that occur in solid heat sinks, maintaining lower temperatures

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances heat transfer efficiency, reduces material deformations, and increases the average power handling capacity of high-energy laser systems by eliminating film boiling and maintaining the laser material below its boiling point.

Implementation Method 1

places the amplifier in direct contact with a cryogenically-cooled flowing liquid

Methodology Applied
Scientific EffectHeat transfer: Conduction (thermal)

Implementation Method 2

a flowing cryogenically-cooled liquid... using a heat exchanger and pump to maintain efficient heat transfer

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 3

a heat exchanger for cooling a cryogenic liquid to a chosen temperature below its boiling point

Methodology Applied
Scientific EffectHeat transfer: Heat Exchanger

Implementation Method 4

a chamber capable of being evacuated to a chosen vacuum... for preventing condensation on the amplifier

Methodology Applied
Scientific EffectVacuum: Vacuum

Data Source

PatentUS9209598B1Cooling system for high average power laser
Publication Date: 2015.12.08 COLORADO STATE UNIV RES FOUND
  • US9209598B1 patent drawing
  • US9209598B1 patent drawing
  • US9209598B1 patent drawing

AI summary

A cryogenic cooling apparatus for high average power laser oscillator or amplifier, wherein the oscillator or amplifier material is in direct contact with a flowing cryogenic liquid cooled to below its boiling point is described. This method of cooling overcomes the limit in heat flux due to the onset of film boiling, thereby allowing for increased laser average power.