Cryogenic Cooling Plates for Rapid HAMR Substrate Cooling

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Solution Overview

Problem

Conventional cooling systems for HAMR media manufacturing are inefficient in rapidly cooling substrates from high temperatures, requiring multiple cooling stations and limiting production throughput due to mechanical difficulties with cryogenic cooling in dynamic systems and inefficiencies in static systems.

Innovation Solution

A cryogenic dynamic cooling apparatus with movable, cryogenically cooled plates that use flexible refrigerant supply lines and a vacuum chamber with process gas to achieve rapid temperature reduction, allowing for non-contact double-sided cooling and increased throughput.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If conventional static cooling systems are used, then the substrate can be cooled, but the cooling rate is slow and multiple cooling chambers are required

Engineering Contradiction:
Improvecooling rateVSAvoidnumber of cooling chambers
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent applies dynamic cooling by moving the substrate through a single cryogenic cooling chamber at controlled speeds, replacing multiple static cooling chambers. The substrate is conveyed dynamically past cryogenically cooled surfaces, enabling rapid cooling in one chamber rather than requiring multiple sequential chambers.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent uses a vacuum chamber with process gas (nitrogen or helium) to enhance heat transfer from the substrate to the cryogenic cooling surfaces. The gas flow dynamics control the cooling rate, allowing rapid heat extraction without direct contact between the substrate and cooling surfaces.

Inventive Principle:
Principle #29Pneumatics and hydraulics

2Productivity

If cryogenic cooling is implemented in dynamic systems, then cooling efficiency improves, but mechanical difficulties arise with flexible refrigerant supply lines

Engineering Contradiction:
Improvecooling efficiencyVSAvoidmechanical implementation
Core Design Contradiction:
ProductivityVSEase of manufacture

Solution Approach 1:

The patent employs flexible refrigerant supply lines that can accommodate the dynamic movement of substrates while maintaining cryogenic temperatures. These flexible conduits deliver cryogenic refrigerant to moving cooling surfaces without rigid mechanical constraints, solving the mechanical implementation challenge.

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

The patent introduces a vacuum chamber with process gas as an intermediary medium between the cryogenic cooling surfaces and the substrate. This mediator enables efficient heat transfer while isolating the mechanical components from direct thermal and mechanical stress, simplifying the overall system design.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Reliability

If multiple cooling chambers are used, then the substrate can be cooled adequately, but capital investment and production throughput are limited

Engineering Contradiction:
Improvecooling adequacyVSAvoidnumber of cooling chambers
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the cooling functions of multiple chambers into a single integrated cryogenic cooling chamber. By combining dynamic substrate conveyance with cryogenic cooling surfaces and controlled gas flow, one chamber performs the cooling work that previously required multiple chambers, reducing capital investment and improving throughput.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent changes the temperature parameter dramatically by introducing cryogenic temperatures (using liquid nitrogen or helium) instead of conventional cooling temperatures. This parameter change enables much faster heat extraction rates, allowing adequate cooling in a single chamber rather than requiring multiple chambers at moderate cooling rates.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The apparatus can cool substrates from 600°C to 150°C or below in 10 seconds or less, supporting high-volume HAMR media production with reduced capital investment by minimizing the number of cooling chambers needed.

Implementation Method 1

The cooling plate temperature is controlled by using either cooling water or a cryogenic refrigerant

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

A cryogenic dynamic cooling apparatus with movable, cryogenically cooled plates

Methodology Applied
Scientific EffectCryogenic cooling: Cryogenics

Implementation Method 3

The vacuum chamber of the cooling station is filled with a process gas such as helium, hydrogen, or a mixture of helium/hydrogen to increase heat transfer

Methodology Applied
Scientific EffectThermal convection: Convection

Data Source

PatentUS10054363B2Method and apparatus for cryogenic dynamic cooling
Publication Date: 2018.08.21 WESTERN DIGITAL TECHNOLOGIES INC
  • US10054363B2 patent drawing
  • US10054363B2 patent drawing
  • US10054363B2 patent drawing

AI summary

A cryogenic dynamic cooling apparatus and a cooling method for heat assisted magnetic recording media substrate are provided. The cooling apparatus includes a chamber that is configured to receive a substrate. A substrate holder secures the substrate inside the chamber. The apparatus has a cooling plate that is movable between a retracted position and an extended position inside the chamber. The cooling plate provides clearance for movement of the substrate holder inside the chamber in the retracted position, and the cooling plate cools the substrate in the extended position. Also, the cooling plate is substantially parallel to and spaced apart from the substrate. The apparatus further includes a cryogenic operatively coupled to the cooling plate that is cooled by the cryogenic cooling element.