Cryogenic Data Acquisition Module Thermal Management

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Solution Overview

Problem

Instrumentation for cryogenic systems faces challenges due to the limited operation of commercially available electronic components below −50° C, leading to issues like electronic noise, heat loss, and increased complexity in sealing and signal transmission, especially in applications involving superconducting magnets and cryogenic fluids.

Innovation Solution

A data acquisition module is developed that includes a thermal package, conditioning and digitizing electronics, a controller module, a power module, and a thermal management module, capable of operating within a cryostat at temperatures between 70° K to 315° K, using multiple overlapping layers for thermal management and an electromechanical thermal valve to maintain efficient temperature control.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If sensors are placed inside the cryostat with wires connecting to external data acquisition, then sensing capability is achieved, but electronic noise and heat loss increase

Engineering Contradiction:

Improvesensing capabilityVSAvoidelectronic noise and heat loss

Core Design Contradiction:

Measurement precisionVSObject-generated harmful factors

Solution Approach 1:

The patent combines the data acquisition module with the sensor environment by placing conditioning and digitizing electronics inside the cryostat. This merging eliminates the need for long wire connections, thereby reducing electronic noise and heat loss while maintaining sensing capability.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent introduces a thermal package as an intermediary structure that provides thermal isolation and mechanical support for the data acquisition module. This intermediary allows the electronics to operate in the cryogenic environment while managing heat transfer and reducing harmful thermal effects.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Productivity

If more wires are passed through the cryostat for signal transmission, then data acquisition capability is improved, but the probability of failure and electrical breakdown risk increases

Engineering Contradiction:

Improvedata acquisition capabilityVSAvoidconnection reliability and electrical breakdown risk

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The patent extracts the data acquisition functions (conditioning and digitizing) from the external environment and places them inside the cryostat. This eliminates the need for multiple wire connections, reducing the probability of failure and electrical breakdown risk while maintaining full data acquisition capability.

Inventive Principle:

Principle #2Taking out (Extraction)

3Ease of manufacture

If conventional electronics are used outside the cryostat, then ease of manufacture is improved, but device complexity and sealing requirements increase

Engineering Contradiction:

Improveelectronics manufacturingVSAvoidsealing complexity and feedthrough interface

Core Design Contradiction:

Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent introduces a thermal package as an intermediary structure that simplifies the feedthrough interface. This package provides integrated thermal isolation, mechanical support, and sealing functions, reducing overall device complexity despite placing electronics inside the cryostat.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution reduces electrical noise, simplifies the feedthrough interface, and increases system reliability by transmitting digital signals at low voltage, significantly reducing the number of wires and the risk of electrical breakdown, while allowing conventional electronics to operate within cryostats.

Implementation Method 1

The thermal package comprises multiple overlapping layers, wherein an outermost layer comprises a material with a low thermal conductivity, a middle layer comprises a metallic layer, and an inner most layer comprises a material with a low thermal conductivity

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

an outermost layer comprises a material with a low thermal conductivity

Methodology Applied

Scientific EffectThermal insulation: Thermal Insulation

Implementation Method 3

the thermal valve comprises an electromechanical device that is controlled by the thermal management module

Methodology Applied

Scientific EffectThermal equilibrium:

Data Source

PatentUS10240875B2Active cryogenic electronic envelope

Publication Date: 2019.03.26 RGT UNIV OF CALIFORNIA

AI summary

A data acquisition module is disclosed for use with electronic components such as superconductive magnets wherein the electronic components and the data acquisition module may reside inside a cryostat. The data acquisition module allows conventional electronic technologies to work inside cryostats at cryogenic temperatures as low as 4° K. This is achieved by management of heat inside the module to keep the module operating at a temperature above the cryogenic temperature. This approach avoids the difficulties that arise from changes in carrier mobility in semiconductors operating at deep cryogenic temperatures. A cryogenic system comprises a cryostat containing a cryogenic fluid and at least one sensor, and a data acquisition module located within the cryostat, the module in communication with the at least one sensor to acquire data, wherein the module comprises a thermal package, a conditioning and digitizing electronic module, a controller module, a power module, and a thermal management module.