Cryogenic Device Exchange via Thermal Switch
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Solution Overview
Problem
Conventional cryostats require extensive time to cool cryogenic devices to operational temperatures, limiting the number of devices that can be tested daily and hindering the pace of quantum research.
Innovation Solution
A new cryostat architecture that allows independent temperature and vacuum control of the cryogenic device, enabling it to be warmed, vented, and exchanged while keeping the larger mass components cold and under vacuum, thus reducing the cryogenic device exchange time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of time
If the entire cryostat system is thermally cycled to exchange a cryogenic device, then the device can be replaced, but the exchange time is limited by the cooling time of the large mass cold source (60-90 minutes)
Solution Approach 1:
The cryostat is divided into two independent vacuum chambers: a first vacuum chamber containing the large mass cold source, and a second vacuum chamber containing the cryogenic device mount. This segmentation allows the device chamber to be thermally cycled independently from the cold source, reducing exchange time while maintaining system functionality.
Solution Approach 2:
The cryogenic device mount and its vacuum chamber are extracted as a separate, independently controllable unit from the main cold source system. This extracted subsystem can be warmed, vented, and re-cooled independently, enabling rapid device exchanges without affecting the cold source.
2Productivity
If a thermal switch is used to engage/disengage thermal communication between the cryogenic device and cold source, then the device can be thermally cycled independently, but the device complexity increases
Solution Approach 1:
A thermal switch acts as an intermediary component between the cold source and the cryogenic device mount, controlling thermal communication. This mediator enables independent thermal cycling of the device chamber while maintaining connection to the cold source when needed, facilitating rapid exchanges.
3Temperature
If the cryogenic device is kept under vacuum and thermally engaged with the cold source continuously, then cooling efficiency is maintained, but the device cannot be quickly warmed and exchanged
Solution Approach 1:
The vacuum barrier and thermal switch provide dynamic control over the thermal and vacuum environment of the cryogenic device. The system can transition between states: vacuum-engaged for cooling, vented for warm-up, and re-engaged for operation, enabling rapid thermal cycling without compromising cooling efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces the cryogenic device exchange time by thermally cycling only the device itself, rather than the entire system, allowing for faster testing and analysis.
Implementation Method 1
typical cryostats used to cool devices to cryogenic temperatures thermally engage to a cold source via a thermal conduit
Implementation Method 2
a cryogenic device mount within a second vacuum chamber, wherein the first and second vacuum chambers are separated by a vacuum barrier
Implementation Method 3
a thermal switch can be utilized to engage/disengage thermal communication between the cryogenic device and the cold source
Data Source
AI summary
Cryogenic device analysis systems are provided that can include: a cold source within a first vacuum chamber; a cryogenic device mount within a second vacuum chamber, wherein the first and second vacuum chambers are separated by a vacuum barrier; a first thermal conduit extending from the cold source through the vacuum barrier to the sample mount; a first thermal switch along the first thermal conduit and operatively aligned between the cold source and the vacuum barrier. Methods for performing analysis of a cryogenic device are also provided.


