Cryogenic Heat Sink Preforms for Superconducting Thermal Contact
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Solution Overview
Problem
CMOS technology-based digital circuits face limitations in device size and high power consumption, especially at high clock speeds, leading to inefficiencies and heat management challenges in cryogenic computing systems.
Innovation Solution
A computing system utilizing superconducting components and devices, featuring heat sinks with recesses and metal preforms that conform to superconducting components, providing effective thermal management and mitigating coefficient of thermal expansion (CTE) mismatch.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If superconducting components are used in cryogenic computing systems, then power consumption is reduced and computing performance is improved, but thermal management becomes more challenging due to large temperature changes and heat dissipation requirements
Solution Approach 1:
The heat sink is divided into multiple recesses, each accommodating specific superconducting components. This segmentation allows for localized thermal management, where each recess can be optimized for the specific thermal characteristics of the components it houses, improving overall heat dissipation efficiency while maintaining the low power consumption benefits of superconducting materials
Solution Approach 2:
Metal preforms are positioned in advance within the heat sink recesses before the superconducting components are installed. These preforms are designed to conform to the components during a pressing operation, ensuring optimal thermal contact is established before operation begins. This preliminary preparation ensures efficient heat dissipation from the moment the system operates, addressing thermal management challenges while preserving the energy efficiency of superconducting components
2Shape
If metal preforms are pressed against superconducting components, then thermal contact is improved and heat dissipation is enhanced, but the components may be damaged by excessive pressure
Solution Approach 1:
The metal preforms serve as cushioning elements that are pressed against the superconducting components with controlled force. The preforms are designed to deform and conform to the component surfaces, distributing the pressing pressure evenly to avoid localized stress concentrations that could damage the components. This beforehand cushioning ensures optimal thermal contact is achieved without compromising component integrity
Solution Approach 2:
The pressing operation temporarily changes the physical state of the metal preforms by applying pressure, causing them to deform and conform to the superconducting component surfaces. After pressing, the preforms retain this conformal shape, maintaining optimal thermal contact. This controlled parameter change (pressure application and release) enables improved thermal contact while the elastic recovery of the preform prevents excessive sustained pressure that could damage components
3Loss of energy
If heat sinks with recesses are used to accommodate superconducting components, then thermal dissipation is improved, but the device complexity increases
Solution Approach 1:
The heat sink with recesses serves multiple functions simultaneously: it provides structural support for the superconducting components, establishes thermal contact through the metal preforms, and dissipates heat from the components. This multi-functionality improves heat dissipation efficiency while avoiding the need for separate support and thermal management structures, thereby limiting the increase in device complexity
Solution Approach 2:
The support structure and thermal management functions are merged into a single integrated heat sink component with recesses. Instead of using separate mounts and thermal interface materials, the heat sink itself is designed with recesses that directly accommodate the superconducting components and house the metal preforms. This merging simplifies the overall structure while achieving effective thermal dissipation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves efficient thermal dissipation and maintains operational stability across large temperature changes, enhancing the performance and efficiency of cryogenic computing systems.
Implementation Method 1
mitigating coefficient of thermal expansion (CTE) mismatch
Implementation Method 2
efficient thermal dissipation
Implementation Method 3
superconducting components and devices... operate at cryogenic temperatures (e.g., 4 K)
Data Source
Figure 1~2
Figure 3
Figure 4~5
AI summary
Computing systems including heat sinks (e.g., a first and a second heatsink) and metal preforms (e.g., a first and a second metal preform) are provided. The first metal preform is bonded to a portion of the first heat sink, where the first metal preform is configured to conform to the at least a portion of a superconducting component when the superconducting component is pressed against the first metal preform and hold shape even after a first pressure on the first metal preform is relieved. The computing system includes a second metal preform bonded to a portion of the second heat sink, where the second metal preform is configured to conform to the at least the portion of a superconducting component when the superconducting component is pressed against the second metal preform and hold shape even after a second pressure on the second metal preform is relieved.