Cryogenic Processor Insulation via Vacuum Shells

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Solution Overview

Problem

Conventional thermal insulation techniques for ultra-low temperature cryogenic processors are inefficient and prone to thermal bridges due to the use of foam insulation, which requires complex multi-step processes and does not effectively prevent heat gain from outer to inner vessel walls.

Innovation Solution

A method involving the use of highly non-compressible foam shells placed around a vessel, evacuated and cryogenically cooled to prevent direct energy pathways, utilizing a combination of vacuum processing and pseudo thermo/kinetic energy transfer to maintain a low partial pressure and remove getter gases, thereby enhancing thermal insulation without structural deformation or metal fatigue.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If foam insulation is used in conventional vacuum insulating panels, then the panel can be manufactured and bonded to plates, but thermal bridges are formed and insulation efficiency is reduced

Engineering Contradiction:

Improvemanufacturability of vacuum insulating panelVSAvoidthermal insulation efficiency

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent uses porous foam material as the substrate for the vacuum insulating panel. The porous structure allows the foam to provide mechanical support and structural integrity while maintaining low thermal conductivity, enabling the panel to be manufactured without compromising insulation efficiency.

Inventive Principle:

Principle #31Porous materials

Solution Approach 2:

The patent creates a vacuum environment within the insulating panel by evacuating the space between the foam substrate and the gas-tight film. This vacuum atmosphere eliminates convection and significantly reduces conduction, preventing thermal bridge formation while maintaining the structural benefits of the foam material.

Inventive Principle:

Principle #39Inert atmosphere (Inert environment)

2Ease of manufacture

If double-sided adhesive film is used to bond vacuum insulation panels to metal cassettes, then the panels can be fixed, but a complicated multi-step process is required and insulation volume is reduced

Engineering Contradiction:

Improvefixing method of vacuum insulation panelVSAvoidnumber of manufacturing steps

Core Design Contradiction:

Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent combines the bonding function and the structural support function into a single integrated system. The foam substrate serves both as the structural base for the vacuum panel and as the bonding medium that adheres directly to the metal cassette, eliminating the need for separate adhesive films and reducing manufacturing steps.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The foam substrate performs multiple functions simultaneously: it provides mechanical strength and rigidity to the vacuum panel, serves as the bonding interface to the metal cassette, and maintains the vacuum seal structure. This multi-functionality simplifies the overall construction process.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Ease of manufacture

If conventional foam filling is used in sandwich panels, then the cavity is filled and structure is complete, but insulation efficiency is reduced compared to vacuum insulation

Engineering Contradiction:

Improvestructural completion of sandwich panelVSAvoidinsulation efficiency

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent replaces the conventional foam filling with a vacuum environment in the cavity between the outer and inner casings. This vacuum atmosphere dramatically reduces heat transfer by eliminating convection and minimizing conduction, achieving superior insulation efficiency while the foam substrate provides the necessary structural support.

Inventive Principle:

Principle #39Inert atmosphere (Inert environment)

Solution Approach 2:

The porous foam substrate is used as a structural support element rather than as the primary insulation medium. Its porous structure provides mechanical integrity to the sandwich panel while the vacuum environment within the cavity delivers the high-performance insulation.

Inventive Principle:

Principle #31Porous materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This technique achieves a theoretical R-value greater than 100, effectively reducing heat gain and preventing structural deformation or metal fatigue, while maintaining efficient insulation performance in ultra-low temperature environments.

Implementation Method 1

places the shells under a vacuum

Methodology Applied

Scientific EffectVacuum: Vacuum

Implementation Method 2

cryogenically cooling the shells to a cryogenic temperature

Methodology Applied

Scientific EffectCryogenics: Cryogenics

Implementation Method 3

allowing the shell temperature to rise from the cryogenic temperature to ambient temperature

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS7823394B2Thermal insulation technique for ultra low temperature cryogenic processor

Publication Date: 2010.11.02 REFLECT SCIENTIFIC INC

AI summary

Systems and methods are disclosed to insulate a vessel includes placing a plurality of shells on all sides of the vessel without providing a direct energy pathway from outer walls of the vessel to the inner walls of the vessel; placing the shells under a vacuum; cryogenically cooling the shells to a cryogenic temperature; and while under vacuum, allowing the shell temperature to rise from the cryogenic temperature to ambient temperature.