Cryogenic MOSFET Gate Interface for Aircraft Power Components
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Solution Overview
Problem
Conventional power electronic systems in aircraft are inefficient due to a suboptimal weight/electrical power ratio, and standard control circuits for power transistors are not suitable for cryogenic environments, where characteristics such as saturation level and resistance vary significantly.
Innovation Solution
An electronic circuit with a power transistor operating at cryogenic temperatures and a control circuit at ambient temperatures, connected via an interfacing circuit, which measures junction temperature and adjusts the power transistor's operation to optimize efficiency while using standard components for gate control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If power transistors operate at cryogenic temperatures to reduce resistance and Joule losses, then efficiency increases, but standard control circuits become unsuitable due to significant variations in transistor characteristics
Solution Approach 1:
The control system is divided into two separate circuits: a first control circuit operating at cryogenic temperature directly connected to the power transistor, and a second control circuit operating at ambient temperature connected to the first control circuit. This segmentation allows each circuit to operate in its optimal temperature range, resolving the contradiction between cryogenic efficiency and control circuit compatibility.
Solution Approach 2:
The first control circuit acts as an intermediary between the ambient temperature control circuit and the cryogenic power transistor. It translates control signals from the ambient temperature circuit into appropriate signals for the cryogenic transistor, accommodating the characteristic variations that occur at low temperatures while maintaining standard control circuit compatibility.
2Weight of moving object
If power transistors operate at cryogenic temperatures, then weight/electrical power ratio improves, but device complexity increases due to temperature management requirements
Solution Approach 1:
The system separates temperature management functions between two control circuits operating at different temperatures. The first control circuit handles cryogenic temperature control directly at the power transistor, while the second control circuit operates at ambient temperature, simplifying the overall temperature management architecture and reducing device complexity.
Solution Approach 2:
The system changes the operating temperature parameter of the control circuits to optimize performance. By operating the second control circuit at ambient temperature rather than cryogenic temperature, the system achieves better weight/electrical power ratio while avoiding the complexity of managing all components at cryogenic temperatures.
3Device complexity
If standard control circuits are used for power transistor gate control, then implementation complexity and cost are reduced, but they cannot properly control power transistors in cryogenic environments due to characteristic variations
Solution Approach 1:
The control system is segmented into two parts: a simple ambient temperature control circuit using standard components, and a cryogenic control circuit that handles the temperature-specific characteristics. This segmentation maintains implementation simplicity while ensuring reliable control in the cryogenic environment.
Solution Approach 2:
The first control circuit serves as an intermediary that adapts standard control signals to the specific requirements of cryogenic power transistors. It compensates for characteristic variations such as saturation level and threshold level changes, ensuring reliable control without requiring the ambient temperature control circuit to be complex.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration increases the efficiency of power transistors under cryogenic conditions while maintaining controlled operation and reducing complexity and cost, enhancing the weight/power ratio in aircraft systems.
Implementation Method 1
use the power components in a cryogenic temperature environment, which greatly reduces resistance and thus Joule losses, and then correspondingly increases efficiency
Data Source
AI summary
An electronic circuit comprising a power transistor of the MOSFET type comprising a gate connected to a control circuit of the gate. The control circuit of the gate configured to operate at a temperature called ambient temperature, non-cryogenic. The power transistor as well as an interfacing circuit connected between said gate and said control circuit configured to operate at a cryogenic temperature. Each component of the interfacing circuit established at a maximum distance (L) from the power transistor. At least one measurement means configured to measure at least one measurement signal, representative of a junction temperature of the power transistor, is connected between the interfacing circuit operating at a cryogenic temperature and the control circuit operating at ambient temperature.