Cryogenic Nozzle Design for Microelectronic Substrate Cleaning
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Solution Overview
Problem
Microelectronic substrates with increasingly dense integrated circuits are susceptible to damage from smaller particles during cleaning processes, as existing techniques struggle to effectively remove particles without damaging the substrate, especially for sub-100 nm particles.
Innovation Solution
The use of cryogenic aerosols and gas cluster jet sprays, formed by expanding fluids from high pressure to sub-atmospheric pressure, with innovative nozzle designs that incorporate flow obstructions to enhance particle removal efficiency without liquification, allowing for improved lateral flow across the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional cleaning techniques are used to remove particles from microelectronic substrates, then particle removal is achieved, but substrate damage occurs especially to smaller device features
Solution Approach 1:
The patent changes the physical parameters of the cleaning fluid by using cryogenic temperatures and controlling phase transitions between liquid, gas, and aerosol states. This allows the cleaning process to remove particles effectively while the low temperature and controlled phase changes prevent damage to sensitive microelectronic features
Solution Approach 2:
The patent introduces an intermediary substance (cryogenic fluid such as nitrogen or argon) that mediates between the cleaning requirement and the substrate protection requirement. The fluid acts as a buffer that can adapt its state (liquid, gas, aerosol) to provide gentle yet effective particle removal without direct mechanical contact that would damage features
2Manufacturing precision
If cryogenic fluids are used to remove sub-100 nm particles, then particle removal efficiency improves, but liquification may occur causing damage
Solution Approach 1:
The patent employs periodic or controlled phase transitions of the cryogenic fluid, alternating between gas jet mode and aerosol mode. This periodic action allows the fluid to remain in a non-liquid state during particle removal while utilizing phase change dynamics to enhance cleaning effectiveness without causing damage from uncontrolled liquification
Solution Approach 2:
The patent deliberately utilizes phase transitions of the cryogenic fluid (between gas, liquid, and aerosol states) as a controlled mechanism to enhance particle removal. By controlling the phase transition process, the system achieves improved cleaning of sub-100 nm particles while preventing harmful liquification through proper temperature and pressure management
3Ease of operation
If standard nozzle designs are used, then fluid flow is straightforward, but particle removal efficiency is insufficient
Solution Approach 1:
The patent segments the nozzle into multiple components (body, cap, internal flow structures) with distinct functions. This segmentation allows optimization of fluid flow paths, creation of specific flow patterns (laminar, turbulent, aerosol), and enhancement of particle removal efficiency while maintaining operational simplicity through modular design
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves particle removal efficiency for sub-100 nm particles while maintaining efficiency for larger particles and reduces substrate damage, achieving effective cleaning with minimal damage to microelectronic features.
Implementation Method 1
the fluid or fluid mixtures may be exposed to the microelectronic substrate in a manner that may remove particles from a surface of the microelectronic substrate. The fluid mixtures may include, but are not limited to, cryogenic aerosols and/or gas cluster jet (GCJ) sprays that may be formed by the expansion of the fluid mixture from a high pressure (e.g., greater than atmospheric pressure) environment to a lower pressure environment (e.g., sub-atmospheric pressure)
Implementation Method 2
The system may include a cryogenic cooling system that may cool the fluid mixture to less than 273K
Data Source
AI summary
Disclosed herein are systems and methods for treating the surface of a microelectronic substrate, and in particular, relate to an apparatus and method for scanning the microelectronic substrate through a cryogenic fluid mixture used to treat an exposed surface of the microelectronic substrate. In particular, an improved nozzle design used to expand the fluid mixture is disclosed herein. In one embodiment, the nozzle design incorporates a two nozzle pieces are combined to form a single nozzle design, in which the two pieces are slight misaligned to form a unique orifice design. In another embodiment, two pieces are combined and aligned along a common axis of the fluid conduit. However, an offset piece is inserted between the two pieces and has a hole that misaligned from the flow conduits of the two other pieces.