Cryogenic probe card
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Solution Overview
Problem
Testing superconductor devices and other low-temperature components is challenging due to inefficient cryostat chambers and mechanical probe malfunctions at low temperatures, requiring more effective and efficient systems for maintaining low temperatures and conducting tests.
Innovation Solution
A cryogenic testing system with a cryostat chamber and a probe card that uses row and column multiplexing to selectively test components at cryogenic temperatures, reducing the number of communication lines and minimizing thermal conductivity, while maintaining temperatures below a threshold (e.g., 10 Kelvin) using a two-dimensional array configuration and cryogenic connectors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a cryostat chamber is employed to maintain low temperatures for testing superconductor devices, then the testing capability at cryogenic temperatures is achieved, but heat transfer through ports reduces the efficiency and effectiveness of temperature maintenance
Solution Approach 1:
The probe card is segmented into multiple independent probes that can be selectively activated. Only the probes corresponding to components under test need to penetrate the cryostat chamber, minimizing the number of ports and associated heat transfer. The probe card structure divides the testing function into discrete, addressable units rather than requiring a comprehensive port structure.
Solution Approach 2:
The patent transitions from a conventional single-plane probe structure to a three-dimensional probe card architecture with probes extending in multiple directions and layers. This dimensional expansion allows more components to be tested through fewer cryostat ports, reducing the port-to-component ratio and minimizing heat transfer pathways.
2Ease of operation
If mechanical movable probes are used for testing components, then individual component testing capability is achieved, but the probes are more likely to malfunction at low temperatures
Solution Approach 1:
The patent replaces traditional mechanical movable probes with a fixed probe card structure where individual probes are selectively activated through electrical switching rather than physical movement. The probe card remains stationary while electronic multiplexing enables selective connection to different components, eliminating the mechanical movement and associated malfunction risks at cryogenic temperatures.
Solution Approach 2:
The system introduces dynamic electrical switching capability to a static mechanical structure. While the probe card itself is fixed, the electrical connections are dynamically reconfigured through switches and multiplexers to test different components sequentially, maintaining individual component testing capability without mechanical probe movement.
3Manufacturing precision
If a conventional probe card with individual probes for each component is used, then complete component coverage is achieved, but the number of communication lines breaching the cryostat chamber increases
Solution Approach 1:
The patent merges multiple communication lines into shared buses that serve multiple components. Instead of dedicating separate communication paths from each probe to the external controller, the probe card implements shared data and control lines that are time-multiplexed to serve different probes and components, reducing the total number of lines breaching the cryostat chamber.
Solution Approach 2:
The communication lines on the probe card are designed with multi-functionality, where the same physical lines can serve multiple probes at different times through electronic switching. The data lines and control lines are universally applicable to any activated probe, eliminating the need for dedicated one-to-one communication paths between each probe and the external controller.
Data Source
AI summary
The various embodiments described herein include methods for testing low temperature components. In some embodiments, a cryogenic testing system includes: (1) a cryostat chamber configured to maintain a sample at temperatures below a threshold temperature, where the sample includes a two-dimensional array of components to be tested, the two-dimensional array comprising a first number (n) of columns and a second number (m) of rows; (2) a probe card including: (a) a set of n column connectors configured to couple to respective columns of the two-dimensional array; and (b) a set of m row connectors configured to couple to respective rows of the two-dimensional array; and (3) a cryogenic connector for communicatively coupling the probe card to a processing unit outside of the cryostat chamber.


