Cryogenic Probe Test Card Ceramic-Filled Resin Fixing

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Solution Overview

Problem

High-performance semiconductor devices, such as those used in quantum computers, face testing challenges due to metal needles contracting in cryogenic environments, leading to inaccurate contact with probe pads and test errors.

Innovation Solution

A probe test card with a substrate and test needles, where the needles are fixed in trenches using a resin layer with ceramic powder, maintaining their position and arrangement despite temperature changes, preventing contraction and ensuring accurate contact.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If metal needles are used in a cryogenic environment, then the test apparatus can operate at low temperatures, but the needles contract and fail to make accurate contact with probe pads

Engineering Contradiction:
Improvecryogenic temperatureVSAvoidcontact accuracy
Core Design Contradiction:
TemperatureVSManufacturing precision

Solution Approach 1:

The patent changes the material parameter of the needle from metal to a composite material (resin layer with ceramic powder) that has different thermal contraction characteristics. This composite material maintains dimensional stability at cryogenic temperatures, preventing the contraction that occurs with metal needles and ensuring accurate contact with probe pads.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent uses a composite material consisting of a resin layer containing ceramic powder instead of pure metal for the needle. This composite structure combines the advantages of different materials: the resin provides flexibility and the ceramic powder provides thermal stability and structural integrity, resulting in a needle that resists contraction in cryogenic environments while maintaining manufacturing precision.

Inventive Principle:
Principle #40Composite materials

2Manufacturing precision

If a fixing layer is added to prevent needle contraction, then contact accuracy is maintained, but the device complexity increases

Engineering Contradiction:
Improvecontact accuracyVSAvoidstructure complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent merges the fixing layer with the needle structure itself, making the needle and its support structure an integrated component. The resin layer with ceramic powder serves both as the needle material and as the fixing mechanism, eliminating the need for separate fixing structures and reducing overall device complexity while maintaining contact accuracy.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The ceramic powder in the fixing layer prevents contraction of the resin, maintaining the gap between test needles and ensuring accurate contact with probe pads, reducing test errors in cryogenic environments.

Implementation Method 1

the ceramic powder may be formed in the trench to fix the test needles... The ceramic powder in the fixing layer prevents contraction of the resin, maintaining the gap between test needles

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS11933818B2Probe test card and method of manufacturing the same
Publication Date: 2024.03.19 SK HYNIX INC
  • US11933818B2 patent drawing
  • US11933818B2 patent drawing
  • US11933818B2 patent drawing

AI summary

A probe test card includes a substrate, a plurality of test needles, and a fixing layer. The substrate includes a first surface at which a trench is formed, and a second surface opposite to the first surface. The plurality of test needles is arranged in the trench. Each test needle includes a first end and a second end being opposite to the first end. The fixing layer is filled in the trench to fix the plurality of test needles in the trench, and a thickness of the fixing layer is same with a depth of the trench. The fixing layer comprises a ceramic powder. The first end of the test needle is non-removably fixed in the trench by the fixing layer and the second end of the test needle protrudes from the trench of the substrate to test a device under test (DUT).