Cryogenic Semiconductor Cooling Device with Composite Thermal Conductivity
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Solution Overview
Problem
Current cooling devices for semiconductor devices are inadequate in maintaining optimal temperature conditions for improved performance and data retention, particularly at low temperatures, leading to inefficiencies in cooling and potential degradation of memory cell transistors.
Innovation Solution
A cooling device with a chamber maintaining reduced pressure, equipped with high thermal conductivity materials for the cooling member and heat transfer part, and a refrigerator that circulates helium-4 for efficient temperature control, allowing for precise temperature adjustment to support both operational and resting states of semiconductor devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional cooling devices are used for semiconductor devices, then cooling function is provided, but cooling efficiency is insufficient and optimal temperature conditions cannot be maintained
Solution Approach 1:
The patent changes the thermal parameters of the cooling system by using cooling members with high thermal conductivity (first cooling member) and moderate thermal conductivity (second cooling member), and adjusts operating temperatures to cryogenic levels (e.g., -40°C to -80°C) to improve cooling efficiency and maintain optimal temperature conditions for data retention
Solution Approach 2:
The patent employs composite cooling structures combining different materials with varying thermal conductivity properties - high thermal conductivity materials for maximum heat dissipation areas and moderate thermal conductivity materials for controlled heat distribution, creating an optimized composite cooling system
2Reliability
If temperature is reduced to improve performance and data retention, then memory cell transistor characteristic dispersion is reduced, but cooling complexity increases
Solution Approach 1:
The cooling system is segmented into multiple independent cooling members (first cooling member with high thermal conductivity, second cooling member with moderate thermal conductivity) that can be independently controlled and optimized, allowing complex cooling requirements to be divided into manageable segments
Solution Approach 2:
Different regions of the cooling system are assigned different thermal conductivity properties - high thermal conductivity materials are applied where maximum heat dissipation is needed, while moderate thermal conductivity materials are used where controlled heat distribution is required, creating local optimization throughout the cooling structure
3Speed
If high thermal conductivity materials are used for cooling members, then heat transfer efficiency is improved, but temperature uniformity across the semiconductor device may deteriorate
Solution Approach 1:
The patent applies high thermal conductivity materials selectively in regions requiring rapid heat removal, while using moderate thermal conductivity materials in regions where gradual heat distribution is needed to maintain temperature uniformity, creating a spatially differentiated thermal conductivity profile
Solution Approach 2:
The cooling system combines materials with different thermal conductivity properties in a composite structure that balances rapid heat transfer with temperature distribution, achieving both high heat transfer efficiency and acceptable temperature uniformity through material composition optimization
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the cooling efficiency of semiconductor devices, reduces characteristic dispersion in memory cell transistors, and improves data retention by maintaining semiconductor devices at cryogenic temperatures, enabling multiple bits of information to be stored per memory cell.
Implementation Method 1
one or a plurality of cooling members provided inside of the internal structure of the chamber, each of the cooling members holding and cooling a semiconductor device; and a heat transfer part exchanging heat with a refrigerator for cooling the cooling member
Implementation Method 2
a refrigerator that circulates helium-4 for efficient temperature control
Data Source
AI summary
A semiconductor device according to an embodiment includes: a chamber including an internal structure capable of holding a pressure in the chamber lower than atmospheric pressure; one or a plurality of cooling member provided inside of the internal structure of the chamber, the cooling member holding and cooling a semiconductor device; and a heat transfer part exchanging heat with a refrigerator cooling the cooling member.