Cryogenic SQUID-Ferroelectric Assembly for Logic-Memory Compatibility
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Solution Overview
Problem
Cryogenic computing applications face challenges in compatibility between control processors and memory devices regarding operating temperature, speed, and power, particularly in quantum computing systems that utilize superconducting quantum interference devices (SQUIDs).
Innovation Solution
A cryogenic superconductive logic gate assembly and memory array are developed, incorporating a ferroelectric layer and heater cryotron devices with SQUIDs, allowing for voltage-controlled polarization states and improved scalability, energy efficiency, and compatibility between control processors and memory devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional control processors and memory devices are used in cryogenic computing, then operating temperature compatibility is improved, but speed and power consumption compatibility deteriorate
Solution Approach 1:
The patent changes the operating parameters of the control processor and memory device to match cryogenic temperatures. Specifically, superconducting materials are used in the control processor and memory device, allowing them to operate at millikelvin temperatures alongside qubits. This parameter change enables temperature compatibility while maintaining high speed operation through superconducting properties.
Solution Approach 2:
The patent employs composite material structures combining superconducting materials with conventional semiconductor materials. The control processor uses superconducting interconnects and logic elements, while the memory device uses superconducting tunnel junctions combined with magnetic tunnel barriers. These composite structures enable simultaneous optimization for cryogenic operation and high-speed performance.
2Temperature
If conventional control processors and memory devices are used in cryogenic computing, then operating temperature compatibility is improved, but power consumption compatibility deteriorates
Solution Approach 1:
The patent changes the energy consumption parameters by utilizing superconducting materials that exhibit zero electrical resistance at cryogenic temperatures. This eliminates ohmic heating in interconnects and logic elements. The memory device uses tunneling current through superconducting barriers, enabling low-power operation. These parameter changes align power consumption characteristics with the cryogenic environment and qubit requirements.
3Measurement precision
If SQUIDs are used in quantum computing systems, then measurement precision is improved, but device complexity increases
Solution Approach 1:
The patent merges the SQUID measurement function with the qubit structure itself. Instead of using separate SQUID devices for reading qubit states, the design integrates readout functionality directly into the qubit architecture using superconducting tunnel junctions. This merging reduces the number of discrete components while maintaining high measurement precision through quantum interference effects.
Solution Approach 2:
The patent creates multi-functional superconducting elements that serve both as qubits and as measurement devices. The superconducting tunnel junctions can operate as computational elements and simultaneously provide readout functionality. This universality reduces device complexity by eliminating dedicated separate measurement apparatus while preserving measurement precision through the inherent quantum properties of the superconducting structures.
4Productivity
If control processors and memory devices are integrated in quantum computing systems, then productivity is improved, but compatibility among components deteriorates
Solution Approach 1:
The patent changes the operating parameters of all components—qubits, control processor, and memory device—to operate within the same cryogenic temperature range and voltage regimes. Superconducting materials enable all components to function at millikelvin temperatures with compatible switching voltages and current characteristics. This parameter harmonization enables system integration while maintaining component compatibility.
Solution Approach 2:
The patent uses composite material architectures that bridge different functional requirements within the integrated system. Superconducting interconnects connect qubits to control logic, while magnetic tunnel barriers provide interface between superconducting and magnetic components in the memory device. These composite structures enable heterogeneous integration of different component types while maintaining electrical and thermal compatibility across the entire system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances compatibility and scalability, reduces mismatch in speed, power consumption, and operating temperature, facilitating large-scale development of quantum computing and superconducting electronics with non-volatile and energy-efficient operations.
Implementation Method 1
The FE layer exhibits a first polarization state or a second polarization state based upon application of a voltage input across the FE layer
Implementation Method 2
a superconducting state of the SQUID(s) is effected at the first polarization state of the FE layer, constituting a logic state zero (0) of the cryogenic superconductive logic gate assembly. And a nonsuperconducting state of the SQUID(s) is effected at the second polarization state of the FE layer
Implementation Method 3
The heater cryotron device is situated near the SQUID(s)
Data Source
AI summary
A cryogenic superconductive electronic assembly employable as a cryogenic superconductive logic gate assembly for control processors, and employable as a cryogenic superconductive memory array for memory devices and systems, is provided. Applications of use include quantum computers and superconducting electronics, as well as spacecraft electronics, among other possibilities. In varying implementations, the cryogenic superconductive electronic assembly is furnished with one or more superconducting quantum interference devices (SQUIDs) that are incorporated with a ferroelectric (FE) material, and are furnished with one or more heater cryotron (hTron) devices.