Cryogenic Substrate Stage Layout for Uniform Temperature Control
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Solution Overview
Problem
Existing substrate treatment apparatuses face challenges in achieving uniform temperature distribution, high aspect ratio structures, and efficient fluid flow when performing cryogenic processes at cryogenic temperatures, particularly in semiconductor manufacturing.
Innovation Solution
A stage design with a flow path partitioned by a thin partition wall, surrounded by an internal element partition, and including peripheral devices at the same height as the flow path, enhances heat transfer and temperature control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional stage design with thick partition walls is used, then structural strength is maintained, but heat transfer rate and temperature distribution are insufficient
Solution Approach 1:
The patent applies this principle by using a thin partition wall (thickness of 0.1 mm to 5 mm) instead of a thick rigid wall in the flow path. This thin wall structure provides sufficient structural strength while allowing efficient heat transfer between the cryogenic fluid and the substrate, resolving the contradiction between structural strength and heat transfer rate.
2Device complexity
If the flow path area is reduced to accommodate peripheral devices, then device integration is improved, but heat transfer efficiency and temperature uniformity deteriorate
Solution Approach 1:
The patent applies this principle by positioning peripheral devices at the same height as the flow path and overlapping them when viewed from above, rather than placing them sequentially in the flow path direction. This spatial arrangement in three dimensions allows the flow path to maintain its full area for efficient heat transfer while still accommodating peripheral devices within the stage structure.
3Ease of operation
If peripheral devices are placed outside the body portion, then device functionality is maintained, but the stage size and complexity increase
Solution Approach 1:
The patent applies this principle by placing peripheral devices inside the body portion of the stage, surrounded by an internal element partition. This nested arrangement integrates multiple functional components within the existing stage structure, reducing overall stage size and complexity while maintaining device functionality and accessibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves heat transfer rate and temperature distribution, enabling precise processing of high aspect ratio semiconductor patterns at cryogenic temperatures.
Implementation Method 1
a flow path configured to flow a fluid; a peripheral device, at least a part of which is located inside the body portion, wherein the part of the peripheral device is positioned at the same height as the flow path and overlaps the flow path when viewed from above
Data Source
AI summary
A stage including: a body portion configured to support a substrate, wherein the body portion includes a flow path; and a peripheral device, at least a part of which is located inside the body portion, wherein the part of the peripheral device is positioned at the same height as the flow path and overlaps the flow path when viewed from above, wherein the flow path is partitioned by a flow path partition wall, wherein the part of the peripheral device is surrounded by an internal element partition and included within an internal space of the internal element partition, wherein a thickness of the flow path partition wall is smaller than a maximum width of the internal space in a direction perpendicular to a side of the flow path partition wall.