Support element, corresponding cryogenic fluid circuit and corresponding method

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Solution Overview

Problem

Existing support elements for cryogenic fluid circuits have mechanical strength issues due to numerous thermal paths required for pipes at different temperatures, leading to low resistance to bending moments and increased heat losses.

Innovation Solution

A support element with grouped orifices and reduced thermal paths, featuring a central and peripheral thermal path configuration that connects orifices and the peripheral edge, enhancing mechanical strength and reducing heat losses while minimizing the number of bores and manufacturing costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If individual thermal paths are provided for each pipe at different temperatures, then thermal isolation is improved, but mechanical strength deteriorates due to low resistance to bending moments

Engineering Contradiction:
Improvethermal isolationVSAvoidresistance to bending moment
Core Design Contradiction:
TemperatureVSStrength

Solution Approach 1:

The patent merges multiple individual thermal paths into a single common thermal path that serves multiple pipes simultaneously. This is achieved by providing a single thermal path in mechanical connection with all orifices of the first set and all orifices of the second set, thereby maintaining thermal isolation functionality while significantly improving mechanical strength by reducing the number of separate structural elements.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The single thermal path is designed to perform multiple functions: it provides thermal isolation for all pipes in the first set and all pipes in the second set simultaneously, acts as a common structural support element, and maintains mechanical connection between the partition and all orifices. This multi-functionality resolves the contradiction by eliminating the need for multiple separate thermal paths.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Temperature

If numerous thermal paths are provided for pipes at different temperatures, then thermal isolation is improved, but device complexity increases due to large number of holes in partition

Engineering Contradiction:
Improvethermal isolationVSAvoidnumber of holes in partition
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent combines the function of multiple thermal paths into a single thermal path structure. Instead of having separate thermal paths requiring separate holes for each pipe, one thermal path is designed to mechanically connect to multiple orifices, thereby reducing the number of holes in the partition from many individual holes to fewer holes while maintaining thermal isolation for all pipes.

Inventive Principle:
Principle #5Merging (Combining)

3Temperature

If numerous thermal paths are provided for pipes at different temperatures, then thermal isolation is improved, but heat losses increase

Engineering Contradiction:
Improvethermal isolationVSAvoidheat losses
Core Design Contradiction:
TemperatureVSLoss of energy

Solution Approach 1:

By merging multiple thermal paths into a single thermal path, the patent reduces the total surface area and material through which heat can conduct. The single thermal path design eliminates redundant thermal conduction paths that would exist with multiple separate thermal paths, thereby reducing overall heat losses while maintaining effective thermal isolation between pipes at different temperatures.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively increases mechanical strength, reduces heat losses, and lowers manufacturing costs by grouping pipes by temperature, creating a temperature gradient that minimizes thermal disruptions and requires fewer holes in the partition.

Implementation Method 1

These mechanical devices lengthen the mechanical conduction path between two points which are mechanically connected and which are at different temperatures

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP3074702B1Support element, corresponding cryogenic fluid circuit and corresponding method
Publication Date: 2017.08.16 LAIR LIQUIDE SA POUR LETUDE & LEXPLOITATION DES PROCEDES GEORGES CLAUDE
  • EP3074702B1 patent drawingFigure 1~2
  • EP3074702B1 patent drawingFigure 3~4

AI summary

Support element and method for a cryogenic fluid circuit comprising a plurality of orifices (2, 3) intended for the passage of cryogenic-fluid transfer pipes, said support element (1) comprising at least one thermal path (4, 5) formed between two adjacent orifices (2, 3), the thermal path (4, 5) comprising a blind opening, the opening (4, 5) being delimited by two spaced-apart walls (14, 24; 15, 25) extending between two ends in a longitudinal direction perpendicular to the plane of the orifices (2, 3), the two walls (14, 24; 15, 25) being joined together by an end wall (34, 25), the support element (1) being characterized in that it comprises a first set of orifices (2) which is surrounded by a first thermal path (5) and a second set of orifices (3), the first thermal path (5) being situated between the first set of orifices (2) and the second set of orifices (3), which means to say that the first thermal path (5) is in thermal and mechanical connection with, on the one hand, all the orifices of the first set of orifices (2) and, on the other hand, all the orifices (3) of the second set of orifice (3).