Cryogenic Circuit Support Element With Shared Thermal Paths
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Solution Overview
Problem
Existing cryogenic fluid circuit support elements require numerous thermal paths and holes, compromising mechanical strength and increasing manufacturing costs, while also leading to higher thermal losses due to the need for multiple outlets for pipes at different temperatures.
Innovation Solution
A support element with a first thermal path connecting a set of orifices for colder pipes and a second thermal path connecting these orifices to the peripheral border, reducing the number of thermal paths and holes, and enhancing mechanical strength by grouping pipes by temperature, thereby minimizing thermal losses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If multiple individual outlets are provided for pipes at different temperatures, then thermal management is improved, but mechanical strength is impaired
Solution Approach 1:
The patent merges multiple individual thermal paths into a single common thermal path that serves multiple pipes at different temperatures. Instead of providing separate outlets and thermal paths for each pipe, the invention creates a shared thermal management system where a common thermal path handles thermal isolation for multiple pipes, thereby maintaining mechanical strength while achieving effective thermal management.
Solution Approach 2:
The common thermal path is designed to perform multiple functions simultaneously - it provides thermal isolation for multiple pipes at different temperatures through a single structure. This universal thermal path replaces the need for multiple specialized outlets, reducing the number of holes in the partition while maintaining effective thermal management across different temperature zones.
2Temperature
If multiple individual outlets are provided for pipes at different temperatures, then thermal isolation is improved, but device complexity increases
Solution Approach 1:
The patent combines multiple individual thermal isolation paths into a single common thermal path structure. This merging reduces the complexity of the device by eliminating the need for multiple separate outlets and thermal paths, while still achieving effective thermal isolation for pipes at different temperatures through the shared thermal management system.
3Temperature
If multiple individual outlets are provided for pipes at different temperatures, then thermal management is improved, but manufacturing cost increases
Solution Approach 1:
The patent merges multiple individual thermal paths into a single common thermal path, which reduces manufacturing cost by requiring fewer holes in the partition and less complex assembly procedures. The common thermal path can be manufactured as a single integrated structure, eliminating the need for multiple separate components and reducing overall manufacturing complexity and cost while maintaining effective thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution increases mechanical strength, reduces thermal losses, and lowers manufacturing costs by grouping pipes by temperature, allowing for efficient thermal management and improved mechanical integrity in cryogenic fluid circuits.
Implementation Method 1
These thermal paths use welded tubes that maintain spacings between the two points to be mechanically connected
Data Source
AI summary
Support element and method for a cryogenic fluid circuit comprising a plurality of orifices intended for the passage of cryogenic-fluid transfer pipes, said support element comprising at least one thermal path formed between two adjacent orifices, the thermal path comprising a blind opening, the opening being delimited by two spaced-apart walls extending between two ends in a longitudinal direction perpendicular to the plane of the orifices, the two walls being joined together by an end wall, the support element being characterized in that it comprises a first set of orifices which is surrounded by a first thermal path and a second set of orifices, the first thermal path being situated between the first set of orifices and the second set of orifices, which means to say that the first thermal path is in thermal and mechanical connection with, on the one hand, all the orifices of the first set of orifices and, on the other hand, all the orifices of the second set of orifice.