Cryogenic Apparatus Thermal Interface for Vacuum-Coupled Cooling
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Solution Overview
Problem
Current cryogenic apparatuses face challenges in maintaining high vacuum quality while providing low temperatures within a vacuum chamber, as they often require time-consuming processes that involve heating components to high temperatures, which can damage the apparatus, and cannot efficiently connect to external vacuum chambers without breaching the vacuum.
Innovation Solution
A cryogenic apparatus with a thermal interface that allows connection to an external vacuum chamber without breaking the vacuum, using a cooling arrangement to maintain high vacuum quality and efficiently cool objects within the chamber, while keeping the apparatus components at safe temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the vacuum chamber is heated to high temperatures for vacuum generation, then vacuum quality is improved, but the cryogenic apparatus components are damaged
Solution Approach 1:
The system is divided into two separate vacuum chambers: a first vacuum chamber for the cryogenic apparatus and a second vacuum chamber for vacuum generation. This segmentation allows independent temperature control - the first chamber remains at cryogenic temperatures while the second chamber can be heated to high temperatures for vacuum generation without damaging the cryogenic components.
Solution Approach 2:
A thermal interface arrangement acts as an intermediary between the two vacuum chambers. This interface includes a first thermal interface in the first vacuum chamber and a second thermal interface in the second vacuum chamber, allowing thermal coupling while maintaining physical separation and independent temperature control of the two chambers.
2Temperature
If the cryogenic apparatus is connected to the external vacuum chamber, then cooling capability is improved, but the vacuum in the external chamber is breached
Solution Approach 1:
The system uses two separate vacuum chambers that can be independently prepared and maintained. The external vacuum chamber (second chamber) can be evacuated and sealed independently, then connected to the cryogenic apparatus (first chamber) through the thermal interface arrangement without breaching the vacuum, as the connection is made through a designed interface that maintains vacuum integrity.
3Reliability
If the vacuum chamber components are heated above 100°C for vacuum generation, then vacuum quality is improved, but the components cannot tolerate the high temperature
Solution Approach 1:
By segmenting the system into two separate vacuum chambers, the cryogenic apparatus components remain in the first chamber at safe cryogenic temperatures, while the second chamber can be heated to high temperatures for vacuum generation. The thermal interface arrangement provides the necessary thermal coupling without exposing sensitive components to damaging temperatures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the cryogenic apparatus to provide low temperatures within an external vacuum chamber while maintaining high vacuum quality, improving operational efficiency by separating the vacuum chambers and using thermal interfaces with high thermal conductivity materials to manage temperature differences, thus avoiding the need for time-consuming vacuum preparation processes.
Implementation Method 1
a thermal interface arrangement at (e.g., at an outside of) the vacuum chamber and configured to be cooled by the cooling arrangement
Implementation Method 2
Another technique is to pump down and cool the vessel or parts of the vessel to temperatures below 70K to increase the adsorption of gases on cold surfaces and thus increase the vacuum quality
Data Source
Figure 1A~1B
Figure 2
Figure 3
AI summary
The present disclosure relates to a cryogenic apparatus. The cryogenic apparatus includes a vacuum chamber; a cooling arrangement in the vacuum chamber; and a thermal interface arrangement at the vacuum chamber and configured to be cooled by the cooling arrangement.