Cryostat Thermalization Plate for RF Wireline Heat Dissipation
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Solution Overview
Problem
Existing cryocooled devices face challenges in minimizing thermal power dissipation due to physical connections, particularly with metallic wires, which affect device performance and integrity at cryogenic temperatures, especially when handling high-bandwidth RF signals.
Innovation Solution
The implementation of an Insulated Metal Substrate (IMS) thermalization plate within a cryostat system, which includes a high thermal conductivity layer, a thin dielectric insulating layer, and conductive circuitry layers, effectively redirects and dissipates heat away from the cryogenic sample chamber, maintaining low attenuation and impedance matching for high-frequency signals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metallic wires are used for physical connections between cryocooled device and external system, then electrical conductivity is improved, but thermal power dissipation increases
Solution Approach 1:
The wireline connection is divided into multiple segments with different thermal properties. The first portion uses a material with low thermal conductivity to minimize heat flow from room temperature, while the second portion uses a material with high thermal conductivity to efficiently conduct RF signals at cryogenic temperatures. This segmentation allows each segment to be optimized for its specific function.
Solution Approach 2:
Different portions of the wireline have different thermal and electrical properties optimized for their local requirements. The first portion (at higher temperatures) has low thermal conductivity to reduce heat load, while the second portion (at cryogenic temperatures) has high electrical conductivity for signal transmission. The connection point between these portions is thermally anchored to the cryocooled stage.
2Loss of energy
If wire cross-sectional area is reduced to lower thermal conduction, then thermal power dissipation is reduced, but electrical conductivity deteriorates
Solution Approach 1:
The wireline is segmented into two portions with different cross-sectional areas and materials. The first portion has a smaller cross-sectional area with low thermal conductivity material to minimize heat flow. The second portion has optimized dimensions for high electrical conductivity at cryogenic temperatures. This segmentation resolves the contradiction by allowing each segment to have dimensions optimized for its primary function.
3Temperature
If thermalization is implemented to reduce heat load on device, then device temperature stability is improved, but device performance deteriorates due to thermal connection to low temperature stage
Solution Approach 1:
The wireline is segmented so that only the necessary portion is thermally anchored to the cryocooled stage. The first portion remains thermally isolated to minimize heat load, while the second portion provides the necessary thermal anchoring for RF signal transmission. This optimized segmentation maintains device temperature stability without excessive thermal connection that would degrade performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient thermalization of wirelines, reducing heat load on cryogenic samples, maintaining high-performance detection efficiency for SNSPDs and SSPDs, and facilitating industrialization and mass production of cryostat systems for weak and high-frequency signal transmission.
Implementation Method 1
The implementation of an Insulated Metal Substrate (IMS) thermalization plate within a cryostat system, which includes a high thermal conductivity layer, a thin dielectric insulating layer, and conductive circuitry layers, effectively redirects and dissipates heat away from the cryogenic sample chamber
Implementation Method 2
a thin dielectric insulating layer
Data Source
Figure 1a~1b
Figure 2a~2b
Figure 3
AI summary
Cryogenic device comprising at least two chambers (120, 130) at two different temperatures, a first chamber (130) at a first temperature T1 accommodating a sample (131), and a second chamber (120) at a second temperature T2 greater than T1 and being adapted to accommodate a cooling device (170), said cooling device being adapted to cool wirelines (150, 160) connecting said sample to an external element detector, characterized in that said cooling device is a thermalization plate comprising at least one wire-guide having an input (105) for plugging a wire line (160) connected to the sample and an output (106) for plugging a wire line connected to said external element, said wire-guide being thermally connected to the first chamber.