Crystal Chip Adhesive Layout for Low-Impedance Resonator Bonding
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Solution Overview
Problem
The existing adhesive dispensing techniques for crystal resonators, such as the 4, 5, or 6 adhesive point methods, face issues like 'chip falling-off' and 'adhesive split' due to precision problems in the dispensing machine, leading to increased impedance values and decreased production yield, especially when used in low frequency products under external forces like ultrasound or drop techniques.
Innovation Solution
A specific adhesive dispensing needle and method are introduced, which involve a unique spatial relationship between the conductive seat, integrated chip, and conductive adhesives, allowing for better capture of vibration energy and enhanced support intensity, thereby preventing 'chip falling-off' and 'adhesive split' phenomena, and optimizing the production efficiency by adjusting the contact areas and angles of the adhesives.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the adhesive point is enlarged to fix the integrated chip, then the fixing strength is improved, but the adhesive point generates interference to the oscillation of the crystal chip
Solution Approach 1:
The conductive adhesive is applied in two distinct locations: a first adhesive point at a corner of the conductive seat for strong fixation, and a second adhesive point at the center for minimal oscillation interference. This local differentiation allows each adhesive point to serve its specific function optimally.
Solution Approach 2:
The single adhesive application is segmented into two separate adhesive points with different characteristics. The first adhesive point provides strong bonding at the corner, while the second adhesive point at the center provides minimal interference to the crystal chip's oscillation, achieving both fixation strength and oscillation quality.
2Ease of manufacture
If conventional adhesive dispensing techniques are used, then the production process is simple, but chip falling-off and adhesive split occur due to precision problems
Solution Approach 1:
A positioning structure is introduced as an intermediary element between the conductive seat and the integrated chip. This positioning structure ensures precise alignment and stable positioning during the adhesive dispensing process, preventing chip falling-off and adhesive split while maintaining production simplicity.
Solution Approach 2:
The positioning structure is prepared in advance on the conductive seat before adhesive dispensing. This preliminary action ensures that the integrated chip is correctly positioned and stabilized before the adhesive is applied, preventing reliability issues during the bonding process.
3Reliability
If more adhesive points are used to prevent chip falling-off, then the adhesive bonding reliability is improved, but the impedance value increases and production yield decreases
Solution Approach 1:
Instead of uniformly increasing the number of adhesive points, the invention applies adhesive selectively at two specific locations with different functions: a corner adhesive point for strong bonding and a center adhesive point for minimal oscillation interference. This local quality approach maintains low impedance and high production yield while ensuring reliability.
4Strength
If the adhesive point is positioned to maximize contact area, then the adhesive force is improved, but the vibration energy capture is reduced
Solution Approach 1:
The adhesive application is segmented into two distinct points: one at the corner for maximizing adhesive force through strong bonding, and one at the center for minimizing interference with vibration energy capture. This segmentation allows both requirements to be satisfied simultaneously at different locations.
Data Source
AI summary
A crystal device includes a bearing base, an integrated chip and a conductive adhesive unit. The bearing base includes a conductive seat. The integrated chip includes a principal reference plane facing the conductive seat, and having a first major axis. The conductive adhesive unit has a second major axis and an aspect ratio, and is at least partly disposed between the conductive seat and the integrated chip. The aspect ratio ranges from 1.1 to 1.9. The principal reference plane further has a perpendicular projection straight line defined according to the second major axis. A practical angle is included by the first perpendicular projection straight line and the first major axis, and ranges from 0 degree to 90 degrees.