Crystal Mounting Structure for Low-Resistance Terminal Connection
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Solution Overview
Problem
Conventional crystal devices experience poor conduction due to stress concentration at the connection parts, leading to increased equivalent series resistance values, caused by the shrinkage stress of conductive adhesives during curing.
Innovation Solution
The crystal device design features a crystal blank with strategically positioned excitation electrodes, wiring parts, lead-out terminals, mounting terminals, and connection parts, where the connection parts are superimposed on the lead-out and mounting terminals, reducing stress concentration and improving conduction by using a laminated metal layer structure and vapor deposition or sputtering techniques for connection part formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the first connection part is provided on the side surface of the crystal blank with the same thickness as the lead-out terminal and mounting terminal, then the structure is simple and manufacturing is easy, but the shrinkage stress during conductive adhesive curing causes stress concentration at the end parts, leading to peeling and poor conduction
Solution Approach 1:
The thickness of the connection part in the up-and-down direction is increased to be greater than the thickness of the lead-out terminal and mounting terminal. This parameter change allows the connection part to withstand the shrinkage stress during conductive adhesive curing without stress concentration, preventing peeling and ensuring reliable conduction, while still maintaining a straightforward manufacturing process using vapor deposition or sputtering techniques
Solution Approach 2:
The connection part is formed as a laminated structure with a first metal layer and a second metal layer. The first metal layer (e.g., chromium, nickel, or titanium) provides strong adhesion to the crystal blank, while the second metal layer (e.g., aluminum or copper) provides excellent electrical conductivity. This composite structure simultaneously ensures reliable conduction and resistance to stress-induced peeling
2Device complexity
If the connection part is made thinner to reduce material usage and simplify structure, then manufacturing cost and complexity decrease, but the equivalent series resistance value increases due to poor conduction from stress-induced peeling
Solution Approach 1:
The thickness of the connection part is optimized to be greater than that of the lead-out terminal and mounting terminal. This parameter adjustment reduces the equivalent series resistance by ensuring complete and reliable conduction, preventing peeling under stress, while maintaining a simple overall structure that does not significantly increase device complexity
Solution Approach 2:
The laminated metal layer structure with adhesion-promoting first layer and highly conductive second layer ensures excellent electrical conduction with minimal resistance. This composite approach achieves low equivalent series resistance without requiring excessive material or complex geometry, balancing simplicity with performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design mitigates stress concentration and peeling issues, reducing equivalent series resistance values and enhancing the reliability of conduction between connection and lead-out terminals, thereby improving the performance of the crystal device.
Implementation Method 1
conductive adhesives which are provided between the first mounting pad and the first mounting terminal
Implementation Method 2
vapor deposition or sputtering techniques for connection part formation
Implementation Method 3
vapor deposition or sputtering techniques for connection part formation
Data Source
AI summary
A crystal device has a crystal blank, a first excitation electrode part which is provided on an upper surface of the crystal blank, a first wiring part which extends from the first excitation electrode part to an edge part of the upper surface, a first lead-out terminal which is provided at the edge part of the upper surface of the crystal blank, a first mounting terminal which is provided at a position facing the first lead-out terminal, a first connection part which is provided so that one end is superimposed on the first lead-out terminal and the other end is superimposed on the first mounting terminal, a substrate having a mounting pad which is provided on its upper surface, a conductive adhesive which is provided between the mounting pad and the first mounting terminal, and a lid which is bonded to the upper surface of the substrate.